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ADC1415S065HN/C1,5

NXP Semiconductors

ADC1415S065HN/C1,5 by NXP Semiconductors

ADC1415S065HN/C1,5 by NXP is a 14-bit A/D converter ideal for industrial applications. It features a max linearity error of 0.03% and operates b/w -40 °C to 85 °C with power supplies of 3/5V. Its compact chip carrier design ensures efficient surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,086 parts In-Stock

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3,086

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Digiode

USA . 2,614 parts In-Stock

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2,614

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Anansix

USA . 2,299 parts In-Stock

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2,299

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Distributors (Availability)

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Native Components

USA . 595 parts In-Stock

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$6.192

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595

$6.192

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Ampacity Inc.

Singapore . 2,653 parts In-Stock

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$14.000

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2,653

$14.000

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AZTECH Wire

Italy . 559 parts In-Stock

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$20.440

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559

$20.440

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One Stop Electronics

USA . 735 parts In-Stock

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$21.000

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735

$21.000

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Component Stockers USA

USA . 290 parts In-Stock

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$99.990

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290

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 9,578 parts In-Stock

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Microchip USA

USA . 7,566 parts In-Stock

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Corphita

USA . 2,794 parts In-Stock

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UNI Independent Distributors

Spain . 1,814 parts In-Stock

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Northwest PG Solutions

USA . 1,012 parts In-Stock

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$6.068

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1,012

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$6.068

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Overview

Unlock precision and performance with the ADC1415S065HN/C1,5 from NXP Semiconductors. Renowned for quality and innovation, NXP delivers a robust analog-to-digital converter designed for demanding applications in industrial environments. With exceptional accuracy and a wide operating temperature range, this versatile solution ensures reliable data conversion, empowering your designs to achieve unmatched efficiency and reliability. Experience the NXP advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures reliability and longevity in various applications.

Surface Mount: YES

Allows for compact design and easy integration into modern electronics, saving board space.

Package Shape: SQUARE

Square shape is ideal for uniform mounting and simplifies PCB design.

No. of Bits: 14

14-bit resolution provides high accuracy and precision for applications requiring detailed signal processing.

Maximum Linearity Error (EL): 0.03 %

Low linearity error ensures minimal signal distortion, making it suitable for high-fidelity applications.

Power Supplies (V): 3/5

Dual voltage operation adds versatility for different system requirements, facilitating easier integration.

No. of Terminals: 40

A higher number of terminals provides flexibility for connections, accommodating various designs.

Package Style (Meter): CHIP CARRIER

Chip carrier package style facilitates easy handling and integration in automated assembly processes.

Maximum Operating Temperature: 85 °C

High temperature rating allows operation in demanding environments, enhancing reliability for industrial applications.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures functionality in extreme conditions, making it suitable for outdoor or automotive use.

Terminal Finish: MATTE TIN

The matte tin finish provides excellent solderability, ensuring strong electrical connections.

Terminal Position: QUAD

Quad terminal positioning allows for efficient routing on the PCB, optimizing space utilization.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade performance, ensuring durability and reliability in harsh environments.

Terminal Form: NO LEAD

No-lead design minimizes the risk of solder joint failures and improves thermal performance.

Converter Type: A/D CONVERTER

Analog-to-Digital conversion is critical for converting real-world signals into digital format for processing.

Output Bit Code: OFFSET BINARY

Offset binary encoding is widely used and facilitates simpler digital processing in various applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for a compact layout, supporting modern high-density PCB designs.

Technical Specifications

Analog-to-Digital Converters ADC1415S065HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Maximum Linearity Error (EL):

0.03 %

Electrical Specifications

Power Supplies:

3/5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

40

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC40,.24SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N40

Qualified:

No

JESD-609 Code:

e3

Trade Compliance

ADC1415S065HN/C1,5 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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