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ADC1413S105HN/C1,5

NXP Semiconductors

ADC1413S105HN/C1,5 by NXP Semiconductors

ADC1413S105HN/C1,5 from NXP is a 14-bit A/D converter ideal for industrial applications. It features a max linearity error of 0.03% and operates within -40 °C to 85 °C, powered by 1.8V or 3V supplies. Its compact chip carrier design ensures efficient surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,430 parts In-Stock

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Digiode

USA . 3,109 parts In-Stock

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3,109

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Anansix

USA . 1,083 parts In-Stock

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1,083

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Native Components

USA . 861 parts In-Stock

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$8.870

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861

$8.870

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Northwest PG Solutions

USA . 1,445 parts In-Stock

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$9.757

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$8.781

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$9.757

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One Stop Electronics

USA . 466 parts In-Stock

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$10.000

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466

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AZTECH Wire

Italy . 1,017 parts In-Stock

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$13.250

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Microchip USA

USA . 3,146 parts In-Stock

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UNI Independent Distributors

Spain . 1,396 parts In-Stock

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Corphita

USA . 1,060 parts In-Stock

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Overview

Unlock the power of precision with the ADC1413S105HN/C1,5 from NXP Semiconductors. Renowned for their commitment to excellence, NXP ensures this 14-bit analog-to-digital converter delivers exceptional linearity and reliability in demanding environments. Ideal for industrial applications, it seamlessly transforms analog signals into digital data, enhancing performance and accuracy across various systems. Elevate your projects with NXP’s innovation and watch efficiency soar!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs, saving valuable board space and enabling higher circuit density.

Package Shape: SQUARE

The square package shape offers consistent thermal performance and allows for easy integration into layouts.

No. of Bits: 14

With 14 bits of resolution, this ADC provides high accuracy and finer detail in digital representation of analog signals, making it ideal for precision applications.

Maximum Linearity Error (EL): 0.03%

A linearity error as low as 0.03% ensures high precision and reliability in data conversion, crucial for systems where accuracy is paramount.

Power Supplies (V): 1.8, 3

Dual supply voltage options (1.8V and 3V) offer flexibility in power management, allowing compatibility with a wide range of devices.

No. of Terminals: 32

32 terminals provide ample connectivity options, facilitating integration into complex electronic circuits and systems.

Package Style (Meter): CHIP CARRIER

The chip carrier style enhances thermal dissipation and mechanical stability, contributing to the longevity of the assembly.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C makes this ADC suitable for industrial applications where heat dissipation is a concern.

Minimum Operating Temperature: -40 °C

The capability to operate at -40 °C allows this component to be used in extreme environments, ensuring reliability in various conditions.

Terminal Position: QUAD

The quad terminal position provides easier routing and layout for PCB designs, optimizing space and signal integrity.

Temperature Grade: INDUSTRIAL

An industrial temperature grade signifies robust performance in harsh conditions, making this device a reliable choice for critical applications.

Maximum Analog Input Voltage: 2 V

The support for a maximum analog input voltage of 2 V allows compatibility with low-voltage sensors, ideal for modern low-power applications.

Terminal Form: NO LEAD

No-lead terminal form enhances the soldering process, reduces cleaning requirements, and improves overall reliability of connections.

Converter Type: A/D CONVERTER

Being an A/D converter, it facilitates the transition from analog signals to digital, enabling the integration of analog devices into digital systems.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE

Multiple output formats (offset binary, 2's complement binary, and gray code) provide flexibility in interfacing with various digital systems and simplifies integration.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm allows for high-density designs, making it compatible with modern PCB fabrication techniques.

Technical Specifications

Analog-to-Digital Converters ADC1413S105HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary, Gray Code

Maximum Linearity Error (EL):

0.03 %

Electrical Specifications

Power Supplies:

1.8,3 V

Maximum Analog Input Voltage:

2 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

32

Terminal Form:

Terminal Pitch:

0.025 in (0.635 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC32,.27SQ,25

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N32

Qualified:

No

Trade Compliance

ADC1413S105HN/C1,5 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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