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ADC1413S065HN/C1,5

NXP Semiconductors

ADC1413S065HN/C1,5 by NXP Semiconductors

ADC1413S065HN/C1,5 from NXP is a 14-bit A/D converter ideal for industrial applications. It features a max linearity error of 0.03% and operates b/w -40 °C to 85 °C with power supplies of 1.8V and 3V. Its compact chip carrier design ensures efficient surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 5,359 parts In-Stock

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Anansix

USA . 740 parts In-Stock

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Digiode

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428

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AZTECH Wire

Italy . 141 parts In-Stock

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$10.360

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One Stop Electronics

USA . 480 parts In-Stock

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$18.000

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Component Stockers USA

USA . 486 parts In-Stock

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$99.990

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UNI Independent Distributors

Spain . 6,285 parts In-Stock

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Corphita

USA . 4,746 parts In-Stock

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Microchip USA

USA . 3,937 parts In-Stock

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Native Components

USA . 764 parts In-Stock

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Northwest PG Solutions

USA . 22 parts In-Stock

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Overview

Elevate your designs with the ADC1413S065HN/C1,5 from NXP Semiconductors—a leading name in innovation and reliability. This 14-bit analog-to-digital converter ensures unparalleled precision and minimal error, making it ideal for industrial applications where accuracy matters. With robust performance across a wide temperature range, it seamlessly integrates into diverse environments, delivering exceptional value that empowers your projects to achieve new heights of quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy enhances the product's robustness, ensuring reliability in various environments.

Surface Mount: YES

Surface mount technology allows for easier integration into compact designs, making it ideal for space-constrained applications.

Package Shape: SQUARE

The square package shape provides uniform thermal performance and simplifies PCB layout.

No. of Bits: 14

A 14-bit resolution ensures high precision in measurements, making this converter suitable for applications requiring detailed signal representation.

Maximum Linearity Error (EL): 0.03%

A low maximum linearity error guarantees accurate signal conversion, improving overall system performance.

Power Supplies (V): 1.8, 3

Dual voltage options (1.8V and 3V) enhance flexibility in various power supply designs, facilitating easier integration into different systems.

No. of Terminals: 32

A higher number of terminals provides better connection options, allowing for more complex configurations and increased functionality.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers excellent thermal conductivity and minimizes space usage on the circuit board.

Maximum Operating Temperature: 85 °C

With an operational temperature rating of up to 85 °C, this product is suitable for industrial applications where devices may be exposed to higher temperatures.

Minimum Operating Temperature: -40 °C

The ability to operate in extremely low temperatures (-40 °C) makes it suitable for outdoor or harsh environmental applications.

Terminal Position: QUAD

The quad terminal position provides optimal routing flexibility and compatibility with various PCB designs.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this ADC is built to withstand challenging operating conditions and ensure long-term reliability.

Maximum Analog Input Voltage: 2 V

The 2V maximum analog input voltage is adequate for safe operation in low-voltage applications, protecting sensitive components.

Terminal Form: NO LEAD

A no lead configuration reduces the product's footprint, contributing to more compact and efficient electronic designs.

Converter Type: A/D CONVERTER

As an Analog-to-Digital Converter, this product enables the digital representation of analog signals, essential for modern electronics.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE

Multiple output bit code formats provide versatility in application, accommodating various system requirements.

Terminal Pitch: 0.635 mm

A 0.635 mm terminal pitch allows for high-density PCB designs, making this product suitable for advanced electronic systems.

Technical Specifications

Analog-to-Digital Converters ADC1413S065HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary, Gray Code

Maximum Linearity Error (EL):

0.03 %

Electrical Specifications

Power Supplies:

1.8,3 V

Maximum Analog Input Voltage:

2 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

32

Terminal Form:

Terminal Pitch:

0.025 in (0.635 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC32,.27SQ,25

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N32

Qualified:

No

Trade Compliance

ADC1413S065HN/C1,5 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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