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ADC1412D125HN/C1,5

NXP Semiconductors

ADC1412D125HN/C1,5 by NXP Semiconductors

ADC1412D125HN/C1,5 by NXP is a 14-bit A/D converter ideal for industrial applications. It features a max linearity error of 0.03% and operates within -40 °C to 85 °C, powered by a nominal supply of 3V. Its compact chip carrier design ensures efficient surface mounting.

Median Price

$42.334

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 42 parts In-Stock

1+ parts

-

100+ parts

$37.630

1k+ parts

$33.670

10k+ parts

$31.690

42

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$37.630

$33.670

$31.690

Verical

USA . 42 parts In-Stock

1+ parts

-

100+ parts

$47.038

1k+ parts

$42.087

10k+ parts

$39.612

42

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$47.038

$42.087

$39.612

Distributors (In-Stock)

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Digiode

USA . 214 parts In-Stock

1+ parts

$39.824

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214

$39.824

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Vyrian

USA . 13,146 parts In-Stock

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Anansix

USA . 1,356 parts In-Stock

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1,356

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DigiKey Marketplace

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Distributors (Availability)

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AZTECH Wire

Italy . 894 parts In-Stock

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$11.490

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894

$11.490

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Corphita

USA . 4,725 parts In-Stock

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$37.728

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4,725

$37.728

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Microchip USA

USA . 2,479 parts In-Stock

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$47.154

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2,479

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UNI Independent Distributors

Spain . 2,099 parts In-Stock

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Native Components

USA . 995 parts In-Stock

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995

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Northwest PG Solutions

USA . 476 parts In-Stock

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Perfect Parts

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Overview

Unlock the potential of your designs with the ADC1412D125HN/C1,5 from NXP Semiconductors, a leader in innovation and quality. This robust 14-bit analog-to-digital converter delivers exceptional linearity and performance across diverse applications, from industrial automation to medical devices. Experience unparalleled reliability and efficiency, empowering your projects with precision and speed. Elevate your technology solutions and drive success with NXP’s trusted expertise!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and robustness in various environments.

Surface Mount: YES

Surface mount technology allows for a compact design, making it suitable for high-density applications.

No. of Functions: 2

Having multiple functions increases versatility, allowing it to be used in a wider range of applications.

Package Shape: SQUARE

The square shape aids in efficient circuit layout and simplifies integration into existing designs.

No. of Bits: 14

A 14-bit resolution provides high precision in digital signal processing, making it ideal for demanding applications.

Maximum Linearity Error (EL): 0.03%

A low maximum linearity error ensures accurate signal representation, enhancing the reliability of measurements.

Power Supplies (V): 3

A 3V supply makes it power-efficient, suitable for battery-operated and energy-sensitive applications.

No. of Terminals: 64

With 64 terminals, it offers ample connectivity options for integrating with various systems.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging provides effective thermal management, which can lead to enhanced performance stability.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures allows it to be used in industrial applications without risk of failure.

Minimum Operating Temperature: -40 °C

A wide temperature range makes this product suitable for harsh environments, ensuring reliable performance.

Terminal Finish: MATTE TIN

The matte tin finish helps improve solderability, contributing to easier assembly processes.

Terminal Position: QUAD

Quad terminal positioning helps in efficient routing on printed circuit boards, simplifying design layouts.

Temperature Grade: INDUSTRIAL

Industrial-grade components ensure durability and longevity in a variety of industrial applications.

Maximum Analog Input Voltage: 2 V

A maximum analog input voltage of 2V ensures compatibility with low-voltage sensor systems.

Terminal Form: NO LEAD

No lead terminal form supports modern environmental and safety standards, making it a greener choice.

Converter Type: A/D CONVERTER

As an analog-to-digital converter, it is essential for digitizing analog signals in various electronic systems.

Nominal Supply Voltage: 3 V

Running on a nominal supply voltage of 3V ensures compatibility with standard electronic power supplies.

Output Bit Code: OFFSET BINARY

Unexpected output bit coding provides flexibility in system integration and data processing.

Terminal Pitch: 0.5 mm

A 0.5mm terminal pitch allows for space-efficient designs, further enhancing the miniaturization of circuits.

Technical Specifications

Analog-to-Digital Converters ADC1412D125HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

2

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Maximum Linearity Error (EL):

0.03 %

Electrical Specifications

Power Supplies:

3 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC64,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N64

Qualified:

No

JESD-609 Code:

e3

Trade Compliance

ADC1412D125HN/C1,5 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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