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ADC1412D080HN/C1,5

NXP Semiconductors

ADC1412D080HN/C1,5 by NXP Semiconductors

ADC1412D080HN/C1,5 from NXP is a 14-bit A/D converter ideal for industrial applications. It features a max linearity error of 0.03% and operates within -40 °C to 85 °C, ensuring reliable performance in diverse environments. Its compact chip carrier design supports surface mounting for efficient integration.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 10,513 parts In-Stock

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Digiode

USA . 2,489 parts In-Stock

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Anansix

USA . 546 parts In-Stock

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546

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Native Components

USA . 713 parts In-Stock

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$8.970

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713

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Northwest PG Solutions

USA . 2,122 parts In-Stock

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$9.867

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$8.880

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AZTECH Wire

Italy . 728 parts In-Stock

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$10.650

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728

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One Stop Electronics

USA . 1,348 parts In-Stock

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$21.000

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1,348

$21.000

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QUARKTWIN TECHNOLOGY LTD

USA . 17,507 parts In-Stock

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UNI Independent Distributors

Spain . 4,450 parts In-Stock

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Microchip USA

USA . 2,595 parts In-Stock

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Corphita

USA . 1,502 parts In-Stock

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Overview

Unlock unparalleled performance with the ADC1412D080HN/C1,5 from NXP Semiconductors. This cutting-edge analog-to-digital converter delivers exceptional precision and reliability, making it perfect for industrial applications. Designed with a robust temperature grade, it thrives in demanding environments while ensuring accuracy you can trust. Experience the quality and innovation that NXP stands for, and elevate your projects with enhanced data conversion capabilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and protects components from environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of board space, enabling more functionality in smaller devices.

No. of Functions: 2

Having multiple functions in a single package reduces overall component count, simplifying design and reducing costs.

Package Shape: SQUARE

The square package shape enhances PCB layout flexibility, allowing for efficient routing of traces and optimal use of space.

No. of Bits: 14

With 14 bits of resolution, this ADC provides high accuracy and precision, making it ideal for applications requiring detailed signal representation.

Maximum Linearity Error (EL): 0.03 %

The low maximum linearity error ensures high fidelity in signal conversion, making it suitable for precise measurement applications.

Power Supplies (V): 3

Operating at 3V power supply makes this product energy-efficient, which is crucial for battery-powered devices and applications.

No. of Terminals: 64

A higher number of terminals provides greater connectivity options, allowing for more complex integration and functionality within designs.

Package Style (Meter): CHIP CARRIER

This chip carrier style supports robust mounting and thermal management, ideal for industrial applications with high heat exposure.

Maximum Operating Temperature: 85 °C

The capability to operate at 85 °C ensures reliability in demanding environments, enhancing product longevity.

Minimum Operating Temperature: -40 °C

The ability to function at -40 °C expands the product's usability in extreme cold conditions, making it suitable for a wide range of climates.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, enhancing the reliability of connections on the PCB.

Terminal Position: QUAD

Quad terminal positioning enables efficient layout options for compact designs, facilitating better space management in PCB design.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature ranges, this device is suitable for use in harsh environments, ensuring consistent performance.

Maximum Analog Input Voltage: 2 V

The maximum analog input voltage of 2V makes it compatible with low-voltage analog signals, ideal for modern sensor applications.

Terminal Form: NO LEAD

No-lead design allows for better thermal performance and can help minimize PCB footprint, which is beneficial in space-constrained designs.

Converter Type: A/D CONVERTER

As an Analog-to-Digital Converter, this product is crucial for converting real-world analog signals into digital form, enabling digital processing.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V supports compatibility with a wide range of digital systems, simplifying integration.

Output Bit Code: OFFSET BINARY

The use of offset binary encoding allows for simpler digital processing and conversion, which can enhance system performance.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch is suitable for high-density PCB layouts, enabling more efficient space usage on modern circuit boards.

Technical Specifications

Analog-to-Digital Converters ADC1412D080HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

2

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Maximum Linearity Error (EL):

0.03 %

Electrical Specifications

Power Supplies:

3 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC64,.35SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N64

Qualified:

No

JESD-609 Code:

e3

Trade Compliance

ADC1412D080HN/C1,5 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.3

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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