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ADC1410S105HN/C1,5

NXP Semiconductors

ADC1410S105HN/C1,5 by NXP Semiconductors

ADC1410S105HN/C1,5 from NXP is a 14-bit A/D converter ideal for industrial applications. It features a max linearity error of 0.03%, operates b/w -40 °C to 85 °C, and supports a nominal voltage of 3V. Its compact chip carrier design ensures efficient surface mounting.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Digiode

USA . 3,941 parts In-Stock

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Vyrian

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Anansix

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Ampacity Inc.

Singapore . 992 parts In-Stock

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AZTECH Wire

Italy . 794 parts In-Stock

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One Stop Electronics

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QUARKTWIN TECHNOLOGY LTD

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UNI Independent Distributors

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Microchip USA

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Northwest PG Solutions

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Overview

Elevate your designs with the ADC1410S105HN/C1,5 from NXP Semiconductors, a trusted leader in analog-to-digital conversion. This high-performance converter offers unparalleled accuracy and stability across a wide temperature range, making it ideal for industrial applications. Experience exceptional signal fidelity and reliable operation that enhance efficiency and performance, ensuring your projects stand out in any demanding environment. Choose quality, choose NXP!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and protection against environmental factors, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount technology allows for compact designs and can facilitate automated assembly processes, saving time and reducing costs.

Package Shape: SQUARE

The square package shape optimizes space utilization on PCBs, enabling greater design flexibility and efficiency.

No. of Bits: 14

The 14-bit resolution provides high precision and accuracy in signal conversion, making it ideal for demanding applications.

Maximum Linearity Error (EL): 0.03%

With a very low maximum linearity error, this ADC guarantees accurate representation of the input signal, enhancing overall system performance.

Power Supplies (V): 3

Operating on a 3V power supply makes this device energy-efficient, suitable for battery-powered or low-power applications.

No. of Terminals: 40

The 40 terminals offer ample connectivity options for various applications, enhancing versatility in design.

Package Style (Meter): CHIP CARRIER

Chip carrier packages provide better thermal and electrical performance, contributing to the longevity and reliability of the device.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this ADC can be used in harsh environments, ensuring robust performance in industrial settings.

Minimum Operating Temperature: -40 °C

The wide operating temperature range guarantees reliability and functionality in extreme conditions, making it ideal for outdoor or rugged applications.

Terminal Position: QUAD

Quad terminal positioning offers efficient layout options, facilitating compact designs and effective thermal management.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature grade, this product meets the rigorous demands of various industrial and commercial applications.

Maximum Analog Input Voltage: 2 V

Supporting a maximum analog input voltage of 2V makes it suitable for low-voltage applications while maintaining signal integrity.

Terminal Form: NO LEAD

No lead construction minimizes environmental impact and enhances reliability by reducing the risk of corrosion and mechanical failure.

Converter Type: A/D CONVERTER

This is a true Analog-to-Digital converter, making it essential for digitizing analog signals in various applications, from sensor interfaces to data acquisition.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V promotes lower power consumption, ideal for energy-sensitive applications.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE

Multiple output bit coding options enhance compatibility with various digital systems, improving integration potential in diverse applications.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density PCB layouts, making it suitable for space-constrained designs.

Technical Specifications

Analog-to-Digital Converters ADC1410S105HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

14

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary, Gray Code

Maximum Linearity Error (EL):

0.03 %

Electrical Specifications

Power Supplies:

3 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

40

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC40,.24SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N40

Qualified:

No

Trade Compliance

ADC1410S105HN/C1,5 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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