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ADC1215S125HN/C1,5

NXP Semiconductors

ADC1215S125HN/C1,5 by NXP Semiconductors

ADC1215S125HN/C1,5 from NXP is a 12-bit A/D converter ideal for industrial applications. It features a max linearity error of 0.03% and operates b/w -40 °C to 85 °C with a supply voltage of 3.5V. Its compact chip carrier design ensures efficient surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,694 parts In-Stock

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4,694

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Vyrian

USA . 3,201 parts In-Stock

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3,201

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Anansix

USA . 2,299 parts In-Stock

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2,299

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Distributors (Availability)

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Native Components

USA . 403 parts In-Stock

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$14.252

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403

$14.252

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Northwest PG Solutions

USA . 1,292 parts In-Stock

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$15.677

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$14.109

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1,292

$15.677

$14.109

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AZTECH Wire

Italy . 1,014 parts In-Stock

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$20.750

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1,014

$20.750

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One Stop Electronics

USA . 273 parts In-Stock

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$22.000

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273

$22.000

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QUARKTWIN TECHNOLOGY LTD

USA . 28,062 parts In-Stock

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Microchip USA

USA . 3,520 parts In-Stock

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3,520

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UNI Independent Distributors

Spain . 2,753 parts In-Stock

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Corphita

USA . 990 parts In-Stock

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990

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Overview

Unlock precision and reliability with the ADC1215S125HN/C1,5 from NXP Semiconductors. This advanced analog-to-digital converter ensures exceptional performance across diverse applications, from industrial automation to consumer electronics. With NXP’s renowned quality backing it, enjoy benefits like low power consumption and superior linearity, making it the smart choice for your next project. Elevate your designs and achieve unmatched accuracy today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures the converter is well protected against environmental factors, increasing reliability.

Surface Mount: YES

Surface mount technology allows for efficient use of space on PCBs, facilitating easier assembly and enhancing performance.

Package Shape: SQUARE

The square package shape provides a balanced design, which can aid in thermal management and space optimization on circuit boards.

No. of Bits: 12

With 12 bits of resolution, this converter can provide more precise digital representations of analog signals, making it ideal for applications requiring high accuracy.

Maximum Linearity Error (EL): 0.03%

A low maximum linearity error ensures high fidelity in signal conversion, which is essential for precise measurements and reliable data.

Power Supplies (V): 3, 5

Support for dual power supply options provides flexibility in integration with different systems, allowing for more versatile application designs.

No. of Terminals: 40

Having 40 terminals facilitates various connection options, enhancing adaptability for different circuit configurations.

Package Style (Meter): CHIP CARRIER

The chip carrier package style is designed for reliable electrical performance and is suited for automated assembly processes.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this converter is suitable for industrial environments where equipment might be exposed to elevated temperatures.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures reliable functionality in extreme cold conditions, making it suitable for outdoor and harsh environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish offers good solderability and protection against oxidation, ensuring long-term performance and easier assembly.

Terminal Position: QUAD

Quad terminal position allows for space-efficient layout and easy routing of connections on printed circuit boards.

Temperature Grade: INDUSTRIAL

Industrial temperature grading indicates robustness and reliability, fulfilling the needs of demanding applications in various sectors.

Maximum Analog Input Voltage: 2 V

A maximum analog input voltage of 2V makes this ADC suitable for low-voltage applications, enhancing compatibility with modern sensor technologies.

Terminal Form: NO LEAD

No lead configuration improves the environmental footprint and allows for better thermal performance in compact designs.

Converter Type: A/D CONVERTER

Being an Analog-to-Digital converter means this product is essential for bridging analog signals to digital formats, crucial in modern electronics.

Output Bit Code: OFFSET BINARY

The offset binary output format simplifies digital signal processing, making it easier to integrate with various digital systems.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for dense packaging of components, making it suitable for compact electronic designs.

Technical Specifications

Analog-to-Digital Converters ADC1215S125HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Maximum Linearity Error (EL):

0.03 %

Electrical Specifications

Power Supplies:

3,5 V

Maximum Analog Input Voltage:

2 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

40

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC40,.24SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N40

Qualified:

No

JESD-609 Code:

e3

Trade Compliance

ADC1215S125HN/C1,5 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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