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ADC1215S080HN/C1,5

NXP Semiconductors

ADC1215S080HN/C1,5 by NXP Semiconductors

ADC1215S080HN/C1,5 from NXP is a 12-bit A/D converter ideal for industrial applications. It features a max linearity error of 0.03%, operates b/w -40 °C to 85 °C, and supports power supplies of 3.5V. Its compact chip carrier design ensures efficient surface mounting.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 4,082 parts In-Stock

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Digiode

USA . 919 parts In-Stock

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Anansix

USA . 846 parts In-Stock

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846

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AZTECH Wire

Italy . 334 parts In-Stock

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$15.410

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One Stop Electronics

USA . 1,543 parts In-Stock

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$16.000

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Native Components

USA . 288 parts In-Stock

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$19.950

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Northwest PG Solutions

USA . 990 parts In-Stock

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$21.945

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$19.751

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990

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Component Stockers USA

USA . 213 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 11,204 parts In-Stock

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Microchip USA

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UNI Independent Distributors

Spain . 2,815 parts In-Stock

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Corphita

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Overview

Elevate your projects with the ADC1215S080HN/C1,5 from NXP Semiconductors! Engineered for precision and reliability, this 12-bit analog-to-digital converter excels in demanding industrial applications. With a proven track record of quality and innovation, NXP delivers exceptional performance under varying temperatures, ensuring your designs stand out. Trust in NXP’s expertise to enhance your data acquisition systems with unparalleled accuracy and efficiency!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy package protects the internal components, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern electronic systems.

Package Shape: SQUARE

The square package shape provides efficient use of space on PCBs, facilitating high-density designs.

No. of Bits: 12

With 12 bits of resolution, this ADC ensures precise and accurate data conversion for high-quality signal processing.

Maximum Linearity Error (EL): 0.03%

A low maximum linearity error indicates high accuracy in converting analog signals, which is critical for precision applications.

Power Supplies (V): 3.5

Operating at 3.5V makes this product energy-efficient and suitable for battery-powered devices.

No. of Terminals: 40

With 40 terminals, the ADC accommodates multiple connections for various functionalities, enhancing versatility.

Package Style (Meter): CHIP CARRIER

The chip carrier design allows for easy mounting and integration on PCBs, simplifying assembly processes.

Maximum Operating Temperature: 85 °C

A high operating temperature rating ensures reliability and performance in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The capability to function in extreme cold makes this ADC suitable for harsh environmental conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides excellent solderability and corrosion resistance, contributing to device longevity.

Terminal Position: QUAD

Quad terminal position facilitates efficient connections and helps to optimize signal integrity.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliable performance in various industrial applications, reinforcing its robustness.

Maximum Analog Input Voltage: 2V

A maximum analog input voltage of 2V makes it compatible with low-voltage signal applications, enhancing versatility.

Terminal Form: NO LEAD

No lead terminals allow for a cleaner design and reduced environmental impact, aligning with modern PCB design practices.

Converter Type: A/D CONVERTER

As an analog-to-digital converter, it effectively bridges the analog and digital domains, essential for modern electronics.

Output Bit Code: OFFSET BINARY

The use of offset binary coding provides easy interfacing with most digital systems, enhancing compatibility.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch is beneficial for high-density applications, allowing compact designs without sacrificing performance.

Technical Specifications

Analog-to-Digital Converters ADC1215S080HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Maximum Linearity Error (EL):

0.03 %

Electrical Specifications

Power Supplies:

3,5 V

Maximum Analog Input Voltage:

2 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

40

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC40,.24SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N40

Qualified:

No

JESD-609 Code:

e3

Trade Compliance

ADC1215S080HN/C1,5 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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