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ADC1215S065HN/C1,5

NXP Semiconductors

ADC1215S065HN/C1,5 by NXP Semiconductors

ADC1215S065HN/C1,5 by NXP is a 12-bit A/D converter ideal for industrial applications. It features a max linearity error of 0.03%, operates b/w -40 °C to 85 °C, and supports power supplies of 3.5V. Its compact chip carrier design ensures efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,680 parts In-Stock

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7,680

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Anansix

USA . 1,857 parts In-Stock

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1,857

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Digiode

USA . 609 parts In-Stock

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609

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Distributors (Availability)

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Native Components

USA . 128 parts In-Stock

1+ parts

$0.350

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$0.336

128

$0.350

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$0.336

Northwest PG Solutions

USA . 867 parts In-Stock

1+ parts

$0.385

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$0.339

867

$0.385

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$0.339

One Stop Electronics

USA . 1,623 parts In-Stock

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$5.000

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1,623

$5.000

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AZTECH Wire

Italy . 638 parts In-Stock

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$8.320

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638

$8.320

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UNI Independent Distributors

Spain . 6,659 parts In-Stock

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6,659

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Microchip USA

USA . 4,781 parts In-Stock

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4,781

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Corphita

USA . 2,411 parts In-Stock

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2,411

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Overview

Unlock unparalleled precision with the ADC1215S065HN/C1,5 from NXP Semiconductors, a trusted leader in innovative technology. This 12-bit Analog-to-Digital Converter is designed for exceptional performance across a wide temperature range, ensuring reliability in industrial applications. Experience superior accuracy and efficiency that enhances your systems, making it the ideal choice for demanding projects where quality matters most. Elevate your designs with NXP’s commitment to excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of space on the circuit board, improving overall design flexibility.

Package Shape: SQUARE

The square package shape aids in uniform thermal distribution and can enhance performance in multi-layer PCB designs.

No. of Bits: 12

A 12-bit resolution provides high accuracy and precision in data conversion and is ideal for applications requiring detailed signal representation.

Maximum Linearity Error (EL): 0.03%

With a maximum linearity error of 0.03%, this converter delivers excellent performance and accuracy in data representation.

Power Supplies (V): 3, 5

Supports dual supply voltages (3V and 5V), offering flexibility in power design and compatibility with various systems.

No. of Terminals: 40

A 40-terminal design facilitates multiple connections, enabling complex usage in sophisticated circuit designs.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging promotes better thermal management and electrical performance in high-density applications.

Maximum Operating Temperature: 85 °C

An extended maximum operating temperature of 85 °C ensures reliable operation in harsh industrial environments.

Minimum Operating Temperature: -40 °C

The capability to operate at as low as -40 °C makes this product suitable for use in extreme temperature conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent solderability, ensuring reliable connections in manufacturing processes.

Terminal Position: QUAD

Quad terminal position enhances versatility in connection configurations and improves circuit board layout options.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature ranges, this product is ideal for demanding applications requiring robust performance.

Maximum Analog Input Voltage: 2 V

A maximum analog input voltage of 2V allows for compatibility with a wide range of sensor inputs, facilitating versatile application use.

Terminal Form: NO LEAD

No-lead terminal form minimizes parasitic capacitance, enhancing performance in high-speed applications.

Converter Type: A/D CONVERTER

As an analog-to-digital converter, this product is essential for interfacing analog signals with digital systems, crucial for modern electronic designs.

Output Bit Code: OFFSET BINARY

Offset binary output format is user-friendly for digital processing, simplifying integration into existing systems.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density mounting on PCBs, conserving space and making it ideal for compact designs.

Technical Specifications

Analog-to-Digital Converters ADC1215S065HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Maximum Linearity Error (EL):

0.03 %

Electrical Specifications

Power Supplies:

3,5 V

Maximum Analog Input Voltage:

2 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

40

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC40,.24SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N40

Qualified:

No

JESD-609 Code:

e3

Trade Compliance

ADC1215S065HN/C1,5 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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