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ADC1213S105HN/C1,5

NXP Semiconductors

ADC1213S105HN/C1,5 by NXP Semiconductors

ADC1213S105HN/C1,5 by NXP is a 12-bit A/D converter ideal for industrial applications. It operates b/w -40 °C to 85 °C with a max linearity error of 0.12% and supports power supplies of 1.8V and 3V. Its compact chip carrier design ensures efficient surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,348 parts In-Stock

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Digiode

USA . 1,549 parts In-Stock

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1,549

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Anansix

USA . 637 parts In-Stock

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637

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Native Components

USA . 415 parts In-Stock

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$0.798

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415

$0.798

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Northwest PG Solutions

USA . 2,286 parts In-Stock

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$0.877

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$0.877

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AZTECH Wire

Italy . 832 parts In-Stock

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$8.930

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832

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One Stop Electronics

USA . 1,223 parts In-Stock

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$15.000

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Component Stockers USA

USA . 749 parts In-Stock

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$99.990

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749

$99.990

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UNI Independent Distributors

Spain . 7,541 parts In-Stock

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Microchip USA

USA . 4,519 parts In-Stock

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4,519

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Corphita

USA . 179 parts In-Stock

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Overview

Unlock precision and reliability with the ADC1213S105HN/C1,5 from NXP Semiconductors. This top-tier analog-to-digital converter excels in delivering outstanding performance across a range of demanding applications, from industrial automation to medical devices. With a robust design ensuring durability in extreme environments, NXP is synonymous with quality. Elevate your projects with unparalleled accuracy and efficiency, making the ADC1213S105HN/C1,5 the perfect choice for discerning engineers looking for excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers excellent durability and protection, making this ADC suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient manufacturing, saving space on PCBs.

Package Shape: SQUARE

The square package shape optimizes space and makes it easier to integrate this ADC into various layouts.

No. of Bits: 12

With 12 bits of resolution, this ADC provides high accuracy and fidelity for a wide range of analog signals.

Maximum Linearity Error (EL): 0.12 %

A low maximum linearity error ensures precise conversion of analog signals, enhancing overall performance.

Power Supplies (V): 1.8, 3

Dual supply voltage options offer flexibility for different circuit implementations, accommodating various designs.

No. of Terminals: 32

A higher terminal count allows for more functionalities and connections, making the ADC more versatile.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging is ideal for high-density applications, providing efficient thermal management and performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in demanding environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

A wide temperature range enables this ADC to function in harsh conditions, expanding its application range.

Terminal Position: QUAD

Quad terminal positioning allows for better connectivity and layout options, enhancing design flexibility.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this ADC is robust and reliable in challenging conditions.

Maximum Analog Input Voltage: 2 V

A 2 V maximum input voltage accommodates a variety of signal types while maintaining safe operation.

Terminal Form: NO LEAD

Leadless design minimizes potential for shorts and enhances performance through reduced parasitic capacitance.

Converter Type: A/D CONVERTER

As an A/D converter, this product is essential for digitizing analog signals, crucial for modern electronics.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE

Flexible output coding options provide adaptability for various processing systems and applications.

Terminal Pitch: 0.635 mm

A small terminal pitch allows for high-density pin configurations, fitting more components within limited PCB space.

Technical Specifications

Analog-to-Digital Converters ADC1213S105HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary, Gray Code

Maximum Linearity Error (EL):

0.12 %

Electrical Specifications

Power Supplies:

1.8,3 V

Maximum Analog Input Voltage:

2 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

32

Terminal Form:

Terminal Pitch:

0.025 in (0.635 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC32,.27SQ,25

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N32

Qualified:

No

Trade Compliance

ADC1213S105HN/C1,5 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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