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ADC1213S065HN/C1,5

NXP Semiconductors

ADC1213S065HN/C1,5 by NXP Semiconductors

ADC1213S065HN/C1,5 by NXP is a 12-bit A/D converter ideal for industrial applications. It operates b/w -40 °C to 85 °C with a max linearity error of 0.12% and supports power supplies of 1.8V and 3V. Its compact chip carrier design ensures efficient surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,520 parts In-Stock

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4,520

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Digiode

USA . 4,031 parts In-Stock

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4,031

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Anansix

USA . 2,530 parts In-Stock

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2,530

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Native Components

USA . 850 parts In-Stock

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$0.591

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850

$0.591

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Northwest PG Solutions

USA . 711 parts In-Stock

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$0.650

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711

$0.650

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AZTECH Wire

Italy . 141 parts In-Stock

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$8.450

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141

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One Stop Electronics

USA . 1,466 parts In-Stock

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$13.000

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Component Stockers USA

USA . 466 parts In-Stock

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$99.990

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466

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Microchip USA

USA . 4,627 parts In-Stock

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Corphita

USA . 2,979 parts In-Stock

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UNI Independent Distributors

Spain . 2,768 parts In-Stock

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Overview

Elevate your designs with the ADC1213S065HN/C1,5 from NXP Semiconductors, a leader in innovation and quality. This state-of-the-art analog-to-digital converter ensures exceptional performance with minimal error, making it perfect for industrial applications where precision is paramount. Its robust temperature range and compact design offer unparalleled reliability, empowering you to create smarter, more efficient systems. Choose NXP for excellence that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and protection against environmental factors, making this ADC suitable for a variety of applications.

Surface Mount: YES

Surface mount capability allows for compact designs, enabling the integration of the ADC into modern electronics with limited board space.

Package Shape: SQUARE

The square package shape offers advantageous layout flexibility for circuit design, which can enhance overall performance.

No. of Bits: 12

A 12-bit resolution provides a good balance of accuracy and performance for most analog signal conversion needs, making it versatile for diverse applications.

Maximum Linearity Error (EL): 0.12%

Low linearity error ensures precise representation of the analog input, which is critical for applications requiring high fidelity and accurate measurements.

Power Supplies (V): 1.8, 3

Dual power supply options provide design flexibility, allowing use in low-power applications or higher performance setups as needed.

No. of Terminals: 32

Having 32 terminals supports multiple functions and connectivity options, facilitating complex circuit designs and integration with other components.

Package Style (Meter): CHIP CARRIER

The chip carrier package style allows for better thermal management, which can enhance performance and reliability under varying conditions.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this ADC is suitable for high-temperature environments, ensuring stable performance in industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate down to -40 °C allows for deployment in harsh environments, making it ideal for outdoor and industrial applications.

Terminal Position: QUAD

Quad terminal positioning enables easier routing and integration into circuit boards, enhancing overall design efficiency.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperatures guarantees reliability and longevity in demanding applications, giving users confidence in performance.

Maximum Analog Input Voltage: 2 V

A maximum input voltage of 2V allows for compatibility with a wide range of analog signals, making it highly versatile for different applications.

Terminal Form: NO LEAD

No-lead terminals contribute to a smaller footprint and improved thermal performance while promoting easier assembly in automated systems.

Converter Type: A/D CONVERTER

As an A/D converter, it effectively bridges the gap between analog signals and digital processing, crucial for modern data acquisition systems.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE

Multiple output bit code formats provide flexibility in interfacing with various digital systems, ensuring compatibility with a broad range of applications.

Terminal Pitch: 0.635 mm

A 0.635 mm terminal pitch supports high-density mounting on PCBs, making it a great choice for applications requiring compact designs.

Technical Specifications

Analog-to-Digital Converters ADC1213S065HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary, Gray Code

Maximum Linearity Error (EL):

0.12 %

Electrical Specifications

Power Supplies:

1.8,3 V

Maximum Analog Input Voltage:

2 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

32

Terminal Form:

Terminal Pitch:

0.025 in (0.635 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC32,.27SQ,25

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N32

Qualified:

No

Trade Compliance

ADC1213S065HN/C1,5 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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