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ADC1213D125HN/C1,1

NXP Semiconductors

ADC1213D125HN/C1,1 by NXP Semiconductors

ADC1213D125HN/C1,1 from NXP is a 12-bit A/D converter ideal for industrial applications. It features a max linearity error of 0.12% and operates b/w -40 °C to 85 °C with power supplies of 1.8V and 3V. Its compact chip carrier design ensures efficient surface mounting.

Median Price

$31.090

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 44 parts In-Stock

1+ parts

-

100+ parts

$31.090

1k+ parts

$27.820

10k+ parts

$26.180

44

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$31.090

$27.820

$26.180

DigiKey

USA . 44 parts In-Stock

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-

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44

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Distributors (In-Stock)

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Digiode

USA . 2,452 parts In-Stock

1+ parts

$32.898

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2,452

$32.898

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Vyrian

USA . 3,697 parts In-Stock

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3,697

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Anansix

USA . 142 parts In-Stock

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142

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Distributors (Availability)

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Native Components

USA . 998 parts In-Stock

1+ parts

$0.539

100+ parts

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998

$0.539

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Northwest PG Solutions

USA . 500 parts In-Stock

1+ parts

$0.593

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500

$0.593

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Corphita

USA . 1,062 parts In-Stock

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$31.167

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1,062

$31.167

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Component Stockers USA

USA . 63 parts In-Stock

1+ parts

$35.160

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63

$35.160

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QUARKTWIN TECHNOLOGY LTD

USA . 23,125 parts In-Stock

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UNI Independent Distributors

Spain . 6,655 parts In-Stock

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Microchip USA

USA . 4,396 parts In-Stock

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Robosynatics

Brazil . 250 parts In-Stock

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$22.483

1k+ parts

$20.819

10k+ parts

$20.819

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$22.483

$20.819

$20.819

Lucentia Tech

USA . 250 parts In-Stock

1+ parts

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$22.483

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$20.819

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$20.819

250

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$22.483

$20.819

$20.819

Overview

Experience precision and reliability with the ADC1213D125HN/C1,1 from NXP Semiconductors, a leader in innovative solutions. This top-tier 12-bit analog-to-digital converter excels in various applications, ensuring high performance even in challenging environments. With a robust design for industrial use, it guarantees exceptional linearity and efficiency. Elevate your projects with NXP's commitment to quality, delivering unmatched value and seamless integration into your systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and provides reliable protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of board space, making it ideal for modern electronic applications.

No. of Functions: 2

Having two functions allows for versatile applications, enabling users to integrate multiple functionalities into a single device.

Package Shape: SQUARE

The square package shape is beneficial for uniform thermal management and easy integration onto circuit boards.

No. of Bits: 12

A 12-bit resolution ensures high precision in signal representation, making it suitable for applications requiring detailed data analysis.

Maximum Linearity Error (EL): 0.12 %

A low linearity error indicates high accuracy in conversion, leading to minimized signal distortion for reliable measurements.

Power Supplies (V): 1.8, 3

Supporting multiple voltage levels enhances compatibility with a wide range of systems and applications.

No. of Terminals: 56

A high terminal count allows for extensive connectivity options, accommodating more signals and functionalities.

Package Style (Meter): CHIP CARRIER

Chip carrier packages provide robust mechanical support while simplifying the soldering process, ensuring reliable performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the device to function reliably in demanding industrial environments.

Minimum Operating Temperature: -40 °C

Capable of functioning at very low temperatures, this product is ideal for use in harsh conditions.

Terminal Finish: MATTE TIN

Matte tin surface finish enhances solderability and provides reliable long-term performance in various applications.

Terminal Position: QUAD

Quad terminal positioning optimizes space management on the PCB and enhances routing flexibility for complex designs.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures high reliability and performance under extreme conditions, making it suitable for industrial applications.

Maximum Analog Input Voltage: 3.4 V

A high maximum analog input voltage allows for the direct interfacing with various sensor outputs and signal levels.

Terminal Form: NO LEAD

No lead terminals increase the product's environmental friendliness and allow for efficient heat dissipation.

Converter Type: A/D CONVERTER

As an A/D converter, this product effectively transforms analog signals into digital format, essential for modern digital systems.

Output Bit Code: OFFSET BINARY

Utilizing an offset binary output enables straightforward interfacing with common digital systems and simplifies data interpretation.

Terminal Pitch: 0.5 mm

A tight terminal pitch allows for a compact layout, ideal for space-constrained designs without sacrificing performance.

Technical Specifications

Analog-to-Digital Converters ADC1213D125HN/C1,1 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

2

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Maximum Linearity Error (EL):

0.12 %

Electrical Specifications

Power Supplies:

1.8,3 V

Maximum Analog Input Voltage:

3.4 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

56

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC56,.31SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N56

Qualified:

No

JESD-609 Code:

e3

Trade Compliance

ADC1213D125HN/C1,1 Converters trade compliance attributes, and parameters.

ECCN

3A991.C.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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