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ADC1213D080HN/C1,5

NXP Semiconductors

ADC1213D080HN/C1,5 by NXP Semiconductors

ADC1213D080HN/C1,5 from NXP is a 12-bit A/D converter ideal for industrial applications. It features a max linearity error of 0.12%, operates b/w -40 °C to 85 °C, and supports power supplies of 1.8V and 3V. Its compact chip carrier design ensures efficient surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,545 parts In-Stock

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Digiode

USA . 2,152 parts In-Stock

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Anansix

USA . 1,360 parts In-Stock

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Native Components

USA . 117 parts In-Stock

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$0.807

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Northwest PG Solutions

USA . 1,915 parts In-Stock

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$0.888

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Andel Nordic

Denmark . 3,493 parts In-Stock

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$1.917

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$1.841

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$1.841

3,493

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$1.841

One Stop Electronics

USA . 1,646 parts In-Stock

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$12.000

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AZTECH Wire

Italy . 837 parts In-Stock

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$20.860

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Corohmni

South Africa . 18 parts In-Stock

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$24.075

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Component Stockers USA

USA . 453 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 22,873 parts In-Stock

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Microchip USA

USA . 7,823 parts In-Stock

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UNI Independent Distributors

Spain . 6,530 parts In-Stock

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Corphita

USA . 2,285 parts In-Stock

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Perfect Parts

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Overview

Unlock precision and performance with the ADC1213D080HN/C1,5 from NXP Semiconductors, a leader in innovation. This high-quality analog-to-digital converter delivers exceptional accuracy and reliability for diverse applications, from industrial automation to medical devices. With its robust design and low power consumption, it ensures optimal performance even in extreme conditions. Experience the benefits of superior technology that enhances your projects and drives success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures long-lasting performance and protection against environmental factors.

Surface Mount: YES

Surface mount capability allows for easier integration into compact electronic designs, optimizing space utilization.

No. of Functions: 2

Dual function capability increases the versatility of the device, making it suitable for various applications.

Package Shape: SQUARE

The square package shape provides a compact footprint that can fit into smaller areas of circuit boards.

No. of Bits: 12

A 12-bit resolution ensures high precision in digital conversions, making it ideal for applications requiring fine measurement details.

Maximum Linearity Error (EL): 0.12 %

Low maximum linearity error indicates high accuracy in signal conversion, enhancing the reliability of signal processing.

Power Supplies (V): 1.8, 3

Flexible power supply options (1.8V and 3V) enable compatibility with various systems and lower power consumption.

No. of Terminals: 56

A larger number of terminals allows for greater connectivity options, enhancing the device's functionality and interfacing capabilities.

Package Style (Meter): CHIP CARRIER

CHIP CARRIER package style supports efficient thermal conduction and electrical performance in tight layouts.

Maximum Operating Temperature: 85 °C

Designed to operate at elevated temperatures, making it suitable for industrial applications with demanding thermal conditions.

Minimum Operating Temperature: -40 °C

A wide temperature range (-40 °C) ensures reliable performance in extreme environments, enhancing its adaptability for various applications.

Terminal Position: QUAD

Quad terminal positioning aids in simplified circuit design, enabling effective space reduction on the PCB.

Temperature Grade: INDUSTRIAL

Industrial temperature grade indicates robust performance in harsh conditions, making it suitable for critical applications.

Maximum Analog Input Voltage: 3.4 V

Supports a maximum analog input voltage of 3.4V, accommodating a variety of sensor outputs and signal levels.

Terminal Form: NO LEAD

No lead configuration minimizes footprint and allows for smooth assembly processes, especially in automated environments.

Converter Type: A/D CONVERTER

As an A/D converter, it effectively transforms analog signals into digital form for processing in digital systems.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

The availability of multiple output bit codes provides flexibility in system integration, catering to different processing requirements.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density connections, suitable for modern compact electronic designs.

Technical Specifications

Analog-to-Digital Converters ADC1213D080HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

2

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary

Maximum Linearity Error (EL):

0.12 %

Electrical Specifications

Power Supplies:

1.8,3 V

Maximum Analog Input Voltage:

3.4 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

56

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC56,.31SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N56

Qualified:

No

Trade Compliance

ADC1213D080HN/C1,5 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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