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ADC1213D065HN/C1,5

NXP Semiconductors

ADC1213D065HN/C1,5 by NXP Semiconductors

ADC1213D065HN/C1,5 by NXP is a 12-bit A/D converter ideal for industrial applications. It features a max linearity error of 0.12%, operates b/w -40 °C to 85 °C, and supports power supplies of 1.8V and 3V. Its compact chip carrier design ensures efficient surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,654 parts In-Stock

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Vyrian

USA . 2,503 parts In-Stock

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2,503

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Anansix

USA . 937 parts In-Stock

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937

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Native Components

USA . 434 parts In-Stock

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$0.502

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434

$0.502

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Northwest PG Solutions

USA . 2,213 parts In-Stock

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$0.552

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$0.486

2,213

$0.552

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$0.486

AZTECH Wire

Italy . 325 parts In-Stock

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$11.850

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325

$11.850

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One Stop Electronics

USA . 213 parts In-Stock

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$20.000

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213

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QUARKTWIN TECHNOLOGY LTD

USA . 25,324 parts In-Stock

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Microchip USA

USA . 3,755 parts In-Stock

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UNI Independent Distributors

Spain . 3,155 parts In-Stock

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Corphita

USA . 1,659 parts In-Stock

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Overview

Elevate your designs with the ADC1213D065HN/C1,5 from NXP Semiconductors, a trusted leader in innovative technology. This high-performance analog-to-digital converter offers precision and reliability across various applications, from industrial automation to IoT devices. With its robust construction and wide temperature range, you can count on exceptional performance in challenging environments. Experience enhanced efficiency and accuracy, ensuring your projects stand out in quality and functionality!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of board space, making this ADC ideal for modern electronic devices.

No. of Functions: 2

Having multiple functions enables versatility in applications, allowing the product to serve various purposes without needing additional components.

Package Shape: SQUARE

The square package shape optimizes space on the PCB and simplifies layout design, improving assembly efficiency.

No. of Bits: 12

With 12 bits of resolution, this ADC provides high accuracy and detail in analog to digital conversion, essential for precision applications.

Maximum Linearity Error (EL): 0.12 %

A low maximum linearity error signifies high accuracy in signal representation, leading to reliable and faithful data conversion.

Power Supplies (V): 1.8, 3

Wide supply voltage options (1.8V and 3V) allow for greater flexibility in design, accommodating various power environments.

No. of Terminals: 56

A higher number of terminals can facilitate more connections and functionality, allowing for robust integration into complex systems.

Package Style (Meter): CHIP CARRIER

The chip carrier style allows for efficient thermal dissipation and simplifies the handling and mounting process on PCBs.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product is suitable for industrial applications where heat can be a concern.

Minimum Operating Temperature: -40 °C

A low minimum operating temperature ensures functionality in extreme conditions, making it suitable for outdoor and harsh environments.

Terminal Position: QUAD

Quad terminal positions provide easier routing on PCBs and can improve overall signal integrity, enhancing performance.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates reliability in varying environmental conditions, suitable for demanding applications.

Maximum Analog Input Voltage: 3.4 V

A maximum analog input voltage of 3.4V allows for the processing of a wider range of signals, beneficial in diverse applications.

Terminal Form: NO LEAD

No lead terminals offer improved performance through reduced parasitic inductance, leading to better signal integrity.

Converter Type: A/D CONVERTER

As an analog-to-digital converter, this product enables the transformation of real-world analog signals into digital format, essential for modern electronics.

Output Bit Code: OFFSET BINARY, 2'S COMPLEMENT BINARY

Support for multiple output formats offers flexibility in integration with different digital systems, broadening its applicability.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density PCB layouts, accommodating modern miniaturization trends in electronics.

Technical Specifications

Analog-to-Digital Converters ADC1213D065HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

2

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary, 2's Complement Binary

Maximum Linearity Error (EL):

0.12 %

Electrical Specifications

Power Supplies:

1.8,3 V

Maximum Analog Input Voltage:

3.4 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

56

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC56,.31SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N56

Qualified:

No

Trade Compliance

ADC1213D065HN/C1,5 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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