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ADC1210S105HN/C1,5

NXP Semiconductors

ADC1210S105HN/C1,5 by NXP Semiconductors

ADC1210S105HN/C1,5 by NXP is a 12-bit A/D converter ideal for industrial applications. It features a max linearity error of 0.03%, operates b/w -40 °C to 85 °C, and supports a nominal voltage of 3V. Its compact chip carrier design ensures efficient surface mounting.

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Vyrian

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AZTECH Wire

Italy . 1,053 parts In-Stock

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One Stop Electronics

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Microchip USA

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Component Stockers USA

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QUARKTWIN TECHNOLOGY LTD

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Overview

Elevate your designs with the ADC1210S105HN/C1,5 from NXP Semiconductors! This high-performance 12-bit Analog-to-Digital Converter excels in precision and reliability, making it perfect for industrial applications. With a robust operating temperature range and surface-mount convenience, it ensures seamless integration into your projects. Trust in NXP's legacy of innovation to enhance your systems with unmatched quality and efficiency, delivering exceptional value and performance every step of the way.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making the converter suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for compact board designs and facilitates easier integration into modern electronic devices.

Package Shape: SQUARE

The square package shape offers efficient space utilization on printed circuit boards, making it ideal for high-density applications.

No. of Bits: 12

A 12-bit resolution provides a good balance between performance and accuracy, enabling precise analog signal representation in digital form.

Maximum Linearity Error (EL): 0.03%

A low maximum linearity error signifies high precision in conversion, ensuring reliable and accurate data acquisition.

Power Supplies (V): 3

The 3V power supply requirement makes this converter compatible with a wide range of low-power applications.

No. of Terminals: 40

Having 40 terminals allows for a large number of input/output connections, offering flexibility in system design.

Package Style (Meter): CHIP CARRIER

Chip carrier style allows for effective heat dissipation and enhanced durability, making it suitable for industrial applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in demanding environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The extended temperature range allows for operation in extreme conditions, enhancing the versatility of the device.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring longer life and enhanced reliability.

Terminal Position: QUAD

Quad terminal positioning allows for efficient connections and helps in maintaining low signal interference.

Temperature Grade: INDUSTRIAL

Industrial temperature grade indicates suitability for harsh environments, ensuring durability and reliability.

Maximum Analog Input Voltage: 2 V

With a maximum analog input voltage of 2V, this converter can handle typical low-voltage applications effectively.

Technology: CMOS

CMOS technology ensures low power consumption and high performance, making this converter suitable for battery-powered devices.

Terminal Form: NO LEAD

No lead terminal form facilitates compact designs and reduces the risk of solder joint fatigue.

Converter Type: A/D CONVERTER

As an A/D converter, this product is crucial for applications requiring precise digital representation of analog signals.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3V allows for compatibility with a wide range of digital systems and components.

Output Bit Code: OFFSET BINARY

The use of offset binary coding allows for efficient digital representation of analog signals, simplifying data processing.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm maximizes the density of connections, making it well-suited for modern, space-constrained designs.

Technical Specifications

Analog-to-Digital Converters ADC1210S105HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

12

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Maximum Linearity Error (EL):

0.03 %

Electrical Specifications

Power Supplies:

3 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

40

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC40,.24SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N40

Qualified:

No

JESD-609 Code:

e3

Trade Compliance

ADC1210S105HN/C1,5 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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