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ADC1010S105HN/C1,5

NXP Semiconductors

ADC1010S105HN/C1,5 by NXP Semiconductors

ADC1010S105HN/C1,5 by NXP is a 10-bit A/D converter ideal for industrial applications. It operates at a nominal voltage of 3V, with a max linearity error of just 0.039%. This surface-mount device functions effectively in temperatures from -40 °C to 85 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,926 parts In-Stock

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8,926

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Digiode

USA . 2,690 parts In-Stock

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2,690

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Anansix

USA . 896 parts In-Stock

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896

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AZTECH Wire

Italy . 829 parts In-Stock

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$15.350

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829

$15.350

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One Stop Electronics

USA . 1,549 parts In-Stock

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$23.000

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1,549

$23.000

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QUARKTWIN TECHNOLOGY LTD

USA . 15,528 parts In-Stock

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15,528

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Microchip USA

USA . 4,864 parts In-Stock

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4,864

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UNI Independent Distributors

Spain . 2,837 parts In-Stock

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Corphita

USA . 1,200 parts In-Stock

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1,200

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Northwest PG Solutions

USA . 876 parts In-Stock

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Native Components

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Overview

Elevate your projects with the ADC1010S105HN/C1,5 from NXP Semiconductors—a leader in innovation and quality. This robust analog-to-digital converter ensures precision and reliability for a wide array of applications, from industrial automation to consumer electronics. With superior performance and an industrial-grade temperature range, you can count on its durability and efficiency, making it the perfect choice for engineers seeking cutting-edge solutions that add real value to their designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures longevity and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for compact designs and easy integration into modern electronic circuits, saving space on PCBs.

Package Shape: SQUARE

The square package shape optimizes space usage in the layout, facilitating easier assembly and improved thermal performance.

No. of Bits: 10

With a 10-bit resolution, this converter provides a good balance between performance and cost, delivering sufficient precision for many applications.

Maximum Linearity Error (EL): 0.039%

Low maximum linearity error ensures accurate conversions, which is critical for applications requiring precise signal representation.

Power Supplies (V): 3

Operating at a low supply voltage of 3V enhances power efficiency, making this ADC ideal for battery-powered devices.

No. of Terminals: 40

A larger number of terminals allows for versatile and flexible connections, enabling integration with various circuit designs.

Package Style (Meter): CHIP CARRIER

Chip carrier style aids in heat dissipation and mechanical robustness, contributing to enhanced performance in demanding environments.

Maximum Operating Temperature: 85 °C

High operational temperature range ensures reliability in harsher conditions, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Versatility in extreme conditions makes this product ideal for outdoor and industrial applications with fluctuating temperatures.

Terminal Finish: MATTE TIN

Matte tin terminal finish improves solderability and protects against oxidation, ensuring long-term reliability of connections.

Terminal Position: QUAD

Quad position offers optimal layout for efficient circuit design and simplifies routing for PCB design.

Temperature Grade: INDUSTRIAL

Designed to meet industrial standards, this component is reliable for prolonged use in demanding applications and environments.

Maximum Analog Input Voltage: 2 V

The capability to handle up to 2V for analog inputs allows for compatibility with a wide range of signal sources.

Terminal Form: NO LEAD

No lead design contributes to a reduced footprint, ideal for low-profile applications and environmental compliance.

Converter Type: A/D CONVERTER

As an A/D converter, it bridges the gap between analog and digital systems, enabling effective digital processing of analog signals.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3V aligns with modern low-power designs, making it energy-efficient for battery-operated applications.

Output Bit Code: OFFSET BINARY

Offset binary output coding simplifies digital data handling and compatibility with various digital processing systems.

Terminal Pitch: 0.5 mm

The small terminal pitch enables denser packaging on PCBs, offering greater design flexibility and compactness.

Technical Specifications

Analog-to-Digital Converters ADC1010S105HN/C1,5 attributes and parameters. Explore more Analog-to-Digital Converters devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

10

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Offset Binary

Maximum Linearity Error (EL):

0.039 %

Electrical Specifications

Power Supplies:

3 V

Maximum Analog Input Voltage:

2 V

Nominal Supply Voltage:

3 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

Terminal Position:

Quad

No. of Terminals:

40

Terminal Form:

Terminal Pitch:

0.02 in (0.5 mm)

Surface Mount:

Yes

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

LCC40,.24SQ,20

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N40

Qualified:

No

JESD-609 Code:

e3

Trade Compliance

ADC1010S105HN/C1,5 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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