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74LVC169PW,118

NXP Semiconductors

74LVC169PW,118 by NXP Semiconductors

BINARY COUNTER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

$0.072

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 27 parts In-Stock

1+ parts

$0.063

100+ parts

$0.061

1k+ parts

-

10k+ parts

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27

$0.063

$0.061

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Chip1Stop

Japan . 27 parts In-Stock

1+ parts

-

100+ parts

$0.080

1k+ parts

-

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27

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$0.080

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,496 parts In-Stock

1+ parts

$0.064

100+ parts

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1,496

$0.064

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Chip Stock

USA . 53,000 parts In-Stock

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53,000

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Netsource Technology, Inc.

USA . 6,449 parts In-Stock

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6,449

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Vyrian

USA . 2,729 parts In-Stock

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2,729

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Rapid Electronics

USA . 2,500 parts In-Stock

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2,500

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IBS Electronics

USA . 2,500 parts In-Stock

1+ parts

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$0.354

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2,500

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$0.354

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TME

Poland . 2,500 parts In-Stock

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2,500

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Anansix

USA . 267 parts In-Stock

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267

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Distributors (Availability)

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Corphita

USA . 4,194 parts In-Stock

1+ parts

$0.060

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4,194

$0.060

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Native Components

USA . 40 parts In-Stock

1+ parts

$7.960

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40

$7.960

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Northwest PG Solutions

USA . 478 parts In-Stock

1+ parts

$8.756

100+ parts

$7.880

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478

$8.756

$7.880

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AZTECH Wire

Italy . 557 parts In-Stock

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$16.750

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557

$16.750

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UNI Independent Distributors

Spain . 4,208 parts In-Stock

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Microchip USA

USA . 365 parts In-Stock

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365

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Perfect Parts

USA . 56 parts In-Stock

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Technical Specifications

Digital Counters 74LVC169PW,118 attributes and parameters. Explore more Digital Counters devices from NXP Semiconductors

Specs

Additional Features:

TCO OUTPUT

Count Direction:

BIDIRECTIONAL

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Load or Preset Input:

YES

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

24 Amp

Operation Mode:

SYNCHRONOUS

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Counters

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Minimum fmax:

150 MHz

Trade Compliance

74LVC169PW,118 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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