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74LV139D,112

NXP Semiconductors

74LV139D,112 by NXP Semiconductors

NXP Semiconductors' 74LV139D,112 is a CMOS Decoder & Drivers with 23ns propagation delay and 39ns tpd. Operating at 3.3V, it has inverted output polarity and can withstand temperatures from -40 to 125°C. Ideal for automotive applications due to its small outline package and dual terminal position.

Median Price

$0.356

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 5,303 parts In-Stock

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$0.335

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$0.278

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$0.248

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Verical

USA . 2,199 parts In-Stock

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$0.377

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$0.310

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Digiode

USA . 839 parts In-Stock

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Vyrian

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Anansix

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A&K Electronics

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Rotakorn

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Bristol Electronics

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Distributors (Availability)

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Corphita

USA . 1,619 parts In-Stock

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$0.127

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Microchip USA

USA . 396 parts In-Stock

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$1.430

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$1.430

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$1.430

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$1.430

396

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$1.430

AZTECH Wire

Italy . 1,105 parts In-Stock

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$11.310

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Continental Prestige Electronics

USA . 7,819 parts In-Stock

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UNI Independent Distributors

Spain . 4,843 parts In-Stock

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Native Components

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Northwest PG Solutions

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Overview

Discover the NXP Semiconductors 74LV139D,112, a high-quality decoder and driver that offers exceptional performance and reliability. With a wide range of applications in automotive and industrial settings, this product provides unmatched value and benefits to customers seeking efficient signal decoding and driving solutions. Trust NXP's expertise and innovation to deliver superior products that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good protection and durability for the package, making it suitable for various applications.

Propagation Delay At Nominal Supply: 23 ns

Low propagation delay ensures fast response and efficient operation of the decoder & driver.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with standard 3.3V power supplies, making it versatile and widely usable in different systems.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability and stability in challenging environments or applications.

Technical Specifications

Decoder & Drivers 74LV139D,112 attributes and parameters. Explore more Decoder & Drivers devices from NXP Semiconductors

Specs

Family:

LV/LV-A/LVX/H

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

23 ns

Propagation Delay (tpd):

39 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

74LV139D,112 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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