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74HCT4017N,652

NXP Semiconductors

74HCT4017N,652 by NXP Semiconductors

RING COUNTER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

$1.600

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 153 parts In-Stock

1+ parts

-

100+ parts

$1.600

1k+ parts

$1.430

10k+ parts

$1.340

153

-

$1.600

$1.430

$1.340

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,934 parts In-Stock

1+ parts

$0.864

100+ parts

-

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4,934

$0.864

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Vyrian

USA . 2,104 parts In-Stock

1+ parts

-

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2,104

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Anansix

USA . 255 parts In-Stock

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255

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,736 parts In-Stock

1+ parts

$0.819

100+ parts

-

1k+ parts

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3,736

$0.819

-

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AZTECH Wire

Italy . 1,116 parts In-Stock

1+ parts

$9.270

100+ parts

-

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1,116

$9.270

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Microchip USA

USA . 294 parts In-Stock

1+ parts

$30.600

100+ parts

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294

$30.600

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Native Components

USA . 362 parts In-Stock

1+ parts

$37.515

100+ parts

-

1k+ parts

-

10k+ parts

$36.014

362

$37.515

-

-

$36.014

Northwest PG Solutions

USA . 938 parts In-Stock

1+ parts

$41.266

100+ parts

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938

$41.266

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UNI Independent Distributors

Spain . 4,889 parts In-Stock

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4,889

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Andel Nordic

Denmark . 3,489 parts In-Stock

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3,489

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Perfect Parts

USA . 1,645 parts In-Stock

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1,645

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Technical Specifications

Digital Counters 74HCT4017N,652 attributes and parameters. Explore more Digital Counters devices from NXP Semiconductors

Specs

Additional Features:

JOHNSON COUNTER WITH 10 DECODED OUTPUTS

Count Direction:

UP

Family:

HCT

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.025 mm

Load Capacitance (CL):

50 pF

Load or Preset Input:

NO

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

4 Amp

Operation Mode:

SYNCHRONOUS

No. of Bits:

10

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Propagation Delay (tpd):

75 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Sub-Category:

Counters

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

7.62 mm

Minimum fmax:

20 MHz

Trade Compliance

74HCT4017N,652 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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