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74HC573N,652

NXP Semiconductors

74HC573N,652 by NXP Semiconductors

NXP Semiconductors' 74HC573N,652 is an 8-bit bus driver with a propagation delay of 45ns at 5V. It features a 3-STATE output and operates in the temperature range of -40 to 125°C. Ideal for automotive applications due to its through-hole terminal form and nickel palladium gold finish.

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Lifecycle Status

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Vyrian

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Atlantic Semiconductor

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Semi Source

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LIBRA Elektronik GmbH

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PC Components Company LLC

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Nova Conductors

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Sensible Micro Corp

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Florida Circuit

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AZTECH Wire

Italy . 238 parts In-Stock

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Corohmni

South Africa . 542 parts In-Stock

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Microchip USA

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Advanced Electronics

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Ampacity Inc.

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Aztec Data Supply Inc.

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Overview

Unlock the power of seamless data transfer with the 74HC573N,652 by NXP Semiconductors. Crafted with precision and expertise, this bus driver/transceiver ensures fast and reliable communication in various applications. With a nominal supply voltage of 5V and 3-STATE output characteristics, this product offers exceptional performance and efficiency. Experience top-notch quality and unmatched value with the 74HC573N,652, setting new standards in connectivity solutions. Elevate your projects with the best in class technology from NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in automotive applications.

Propagation Delay At Nominal Supply: 45 ns

The low propagation delay ensures fast data transmission, making this product suitable for high-speed communication applications.

No. of Bits: 8

Having 8 bits allows for a wide range of data transmission options, making this product versatile for different communication needs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes the product compatible with standard voltage levels, ensuring ease of integration into existing systems.

Load Capacitance (CL): 50 pF

The moderate load capacitance allows for efficient power consumption and signal transmission, making the product energy-efficient.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand harsh environmental conditions, suitable for automotive applications.

Technology: CMOS

Using CMOS technology ensures low power consumption and noise immunity, making the product reliable and efficient in data transmission.

Technical Specifications

Bus Driver & Transceivers 74HC573N,652 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

BROADSIDE VERSION OF 373

Family:

HC/UH

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e4

Length:

26.73 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

BULK

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

45 ns

Propagation Delay (tpd):

225 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

74HC573N,652 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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