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74HC540N-Q100U

NXP Semiconductors

74HC540N-Q100U by NXP Semiconductors

74HC540N-Q100U by NXP is an 8-bit bus driver with a propagation delay of just 30 ns, ideal for automotive applications. It operates b/w -40 °C to 125 °C and supports up to 6A output in a compact dual in-line package. This CMOS device features inverted outputs and AEC-Q100 screening.

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3

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1k+

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Vyrian

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Andel Nordic

Denmark . 2,691 parts In-Stock

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AZTECH Wire

Italy . 503 parts In-Stock

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One Stop Electronics

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Microchip USA

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Ampacity Inc.

Singapore . 851 parts In-Stock

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Overview

Elevate your designs with the 74HC540N-Q100U from NXP Semiconductors, a trusted leader in high-quality automotive components. This robust bus driver delivers exceptional performance with rapid signal propagation and wide operating temperature range, ensuring reliability in even the most demanding environments. Ideal for automotive applications, its advanced features empower engineers to create innovative solutions while benefiting from NXP's commitment to excellence and durability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material enhances the robustness of the product, making it suitable for demanding automotive applications.

Propagation Delay At Nominal Supply: 30 ns

A propagation delay of 30 ns allows for fast signal transmission, ensuring efficient communication in high-speed applications.

Screening Level: AEC-Q100

Being AEC-Q100 certified indicates that the product meets stringent automotive reliability standards, making it a dependable choice for automotive electronics.

Package Shape: RECTANGULAR

The rectangular package shape is ideal for PCB layouts, providing efficient space utilization and easier integration into designs.

No. of Bits: 8

With an 8-bit capability, this product can handle substantial data communication, suitable for various applications requiring multiple signals.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF allows for compatibility with a wide range of circuits, ensuring stability and performance in various configurations.

Power Supplies (V): 2/6

Operating within a 2 to 6V power supply range provides flexibility in design, accommodating both low and higher voltage systems.

No. of Terminals: 20

The 20 terminal configuration provides ample connectivity options, simplifying the integration with complex circuits.

Package Style (Meter): IN-LINE

An in-line package style aids in straightforward assembly, especially in automated manufacturing processes.

Maximum I (ol): 6 Amp

A maximum output low current of 6 Amps allows the device to drive larger loads, making it suitable for applications requiring higher power outputs.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this product is well-suited for use in high-temperature environments typically found in automotive settings.

Output Characteristics: 3-STATE

The 3-state output characteristic allows for versatile signal management in multi-device systems, enabling efficient data routing.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures reliability in extreme cold conditions, making this product ideal for various climates.

Terminal Position: DUAL

The dual terminal position facilitates easier soldering and space allocation on circuit boards, optimizing layout arrangements.

Output Polarity: INVERTED

Inverted output polarity can be beneficial for specific circuit designs, providing functional versatility in signal processing.

Temperature Grade: AUTOMOTIVE

Designed specifically for the automotive grade, this product ensures long-term reliability and performance in automotive applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high speed, making it efficient for battery-powered or energy-sensitive applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form enhances durability and ease of handling during assembly, making it a reliable choice for robust electronic applications.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm is a standard format, facilitating compatibility with various PCB designs and ensuring ease of integration.

Control Type: ENABLE LOW

The enable low control type provides simple and effective logic control, optimizing system integration and reducing complexity.

Technical Specifications

Bus Driver & Transceivers 74HC540N-Q100U attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

ENABLE LOW

JESD-30 Code:

R-PDIP-T20

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

6 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

30 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Sub-Category:

Bus Driver/Transceivers

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

74HC540N-Q100U Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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