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74HC4059DB,112

NXP Semiconductors

74HC4059DB,112 by NXP Semiconductors

DIVIDE BY N COUNTER; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SSOP; Package Shape: RECTANGULAR;

Median Price

$2.062

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 208 parts In-Stock

1+ parts

-

100+ parts

$1.950

1k+ parts

$1.740

10k+ parts

$1.640

208

-

$1.950

$1.740

$1.640

Verical

USA . 208 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.175

10k+ parts

$2.050

208

-

-

$2.175

$2.050

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,535 parts In-Stock

1+ parts

$1.064

100+ parts

-

1k+ parts

-

10k+ parts

-

1,535

$1.064

-

-

-

Vyrian

USA . 8,041 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,041

-

-

-

-

Anansix

USA . 291 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

291

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,927 parts In-Stock

1+ parts

$1.008

100+ parts

-

1k+ parts

-

10k+ parts

-

1,927

$1.008

-

-

-

Northwest PG Solutions

USA . 2,153 parts In-Stock

1+ parts

$2.904

100+ parts

-

1k+ parts

-

10k+ parts

-

2,153

$2.904

-

-

-

AZTECH Wire

Italy . 510 parts In-Stock

1+ parts

$8.470

100+ parts

-

1k+ parts

-

10k+ parts

-

510

$8.470

-

-

-

Microchip USA

USA . 115 parts In-Stock

1+ parts

$14.931

100+ parts

-

1k+ parts

-

10k+ parts

-

115

$14.931

-

-

-

UNI Independent Distributors

Spain . 1,982 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,982

-

-

-

-

Native Components

USA . 420 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.561

10k+ parts

-

420

-

-

$2.561

-

Technical Specifications

Digital Counters 74HC4059DB,112 attributes and parameters. Explore more Digital Counters devices from NXP Semiconductors

Specs

Additional Features:

PROGRAMMABLE TO DIVIDE INPUT BY 3-15999; 10 MODES OF OPERATION; SCHMITT TRIGGER ON CLOCK INPUT

Count Direction:

DOWN

Family:

HC/UH

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.2 mm

Load or Preset Input:

YES

Logic IC Type:

Operation Mode:

ASYNCHRONOUS

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Propagation Delay (tpd):

300 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

5.3 mm

Minimum fmax:

40 MHz

Trade Compliance

74HC4059DB,112 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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