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74AHC138BQ,115

NXP Semiconductors

74AHC138BQ,115 by NXP Semiconductors

NXP Semiconductors' 74AHC138BQ,115 is a CMOS decoder with 11.5 ns propagation delay and 8 Amp max I (ol). It operates at -40 to 125 °C and has a package style of CHIP CARRIER. Ideal for automotive applications requiring fast signal decoding in compact spaces.

Median Price

$0.344

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 122 parts In-Stock

1+ parts

$0.158

100+ parts

$0.064

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-

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122

$0.158

$0.064

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DigiKey

USA . 2,560 parts In-Stock

1+ parts

$0.350

100+ parts

$0.189

1k+ parts

$0.159

10k+ parts

$0.142

2,560

$0.350

$0.189

$0.159

$0.142

Mouser Electronics

USA . 2,091 parts In-Stock

1+ parts

$0.350

100+ parts

$0.175

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$0.159

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$0.138

2,091

$0.350

$0.175

$0.159

$0.138

Rochester

USA . 3,000 parts In-Stock

1+ parts

-

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$0.338

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$0.281

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$0.250

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-

$0.338

$0.281

$0.250

Verical

USA . 3,000 parts In-Stock

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$0.380

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$0.313

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$0.380

$0.313

EBV Elektronik

Germany . 3,000 parts In-Stock

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Chip1Stop

Japan . 122 parts In-Stock

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$0.153

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122

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$0.153

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Distributors (In-Stock)

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Digiode

USA . 1,407 parts In-Stock

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$0.122

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Chip Stock

USA . 170,000 parts In-Stock

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Vyrian

USA . 6,293 parts In-Stock

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Anansix

USA . 1,525 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 418 parts In-Stock

1+ parts

$0.115

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418

$0.115

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Component Stockers USA

USA . 6,283 parts In-Stock

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$0.130

100+ parts

$0.120

1k+ parts

$0.110

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6,283

$0.130

$0.120

$0.110

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AZTECH Wire

Italy . 4,500 parts In-Stock

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$0.160

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$0.160

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Native Components

USA . 1,306 parts In-Stock

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$0.927

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1,306

$0.927

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Northwest PG Solutions

USA . 630 parts In-Stock

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$1.020

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630

$1.020

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Perfect Parts

USA . 10,080 parts In-Stock

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Microchip USA

USA . 9,580 parts In-Stock

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Eastek

USA . 6,000 parts In-Stock

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$0.320

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6,000

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$0.320

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QUARKTWIN TECHNOLOGY LTD

USA . 2,410 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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UNI Independent Distributors

Spain . 1,419 parts In-Stock

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Supply Digital

USA . 635 parts In-Stock

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635

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Overview

Discover the cutting-edge 74AHC138BQ,115 decoder & driver by NXP Semiconductors, a leading manufacturer known for top-quality semiconductor solutions. This versatile chip, featuring a low propagation delay of 11.5 ns and a wide operating temperature range, is perfect for automotive applications and beyond. With surface mount capability and a compact package shape, this product offers high performance and reliability for your projects. Upgrade your designs with the outstanding value and benefits of the 74AHC138BQ,115 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the decoder & driver, making it suitable for various environments.

Propagation Delay At Nominal Supply: 11.5 ns

Low propagation delay ensures fast response time, making this decoder & driver efficient for time-sensitive applications.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard supply voltage, making it compatible with a wide range of systems and components.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for automotive and industrial applications where heat may be a concern.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient and reliable operation of the decoder & driver.

Technical Specifications

Decoder & Drivers 74AHC138BQ,115 attributes and parameters. Explore more Decoder & Drivers devices from NXP Semiconductors

Specs

Family:

AHC/VHC/H/U/V

Input Conditioning:

STANDARD

JESD-30 Code:

R-PQCC-N16

JESD-609 Code:

e4

Length:

3.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.1X.14,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

11.5 ns

Propagation Delay (tpd):

20 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.5 mm

Trade Compliance

74AHC138BQ,115 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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