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70087-3040-012

NXP Semiconductors

70087-3040-012 by NXP Semiconductors

PROXIMITY SENSOR,HALL EFFECT; Output Type: ANALOG VOLTAGE; Package Shape or Style: ROUND; Body Height: 120.6 mm; Body Length/Diameter: 31.8 mm; Termination Type: CABLE;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,855 parts In-Stock

1+ parts

-

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1k+ parts

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3,855

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Anansix

USA . 1,757 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,757

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Digiode

USA . 131 parts In-Stock

1+ parts

-

100+ parts

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131

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 199 parts In-Stock

1+ parts

$0.132

100+ parts

-

1k+ parts

-

10k+ parts

$0.126

199

$0.132

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-

$0.126

Northwest PG Solutions

USA . 834 parts In-Stock

1+ parts

$0.145

100+ parts

-

1k+ parts

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10k+ parts

$0.128

834

$0.145

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$0.128

One Stop Electronics

USA . 1,104 parts In-Stock

1+ parts

$36.750

100+ parts

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1,104

$36.750

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UNI Independent Distributors

Spain . 6,328 parts In-Stock

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6,328

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Corphita

USA . 245 parts In-Stock

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245

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Technical Specifications

Proximity Sensors 70087-3040-012 attributes and parameters. Explore more Proximity Sensors devices from NXP Semiconductors

Specs

Additional Features:

TTL COMPATIBLE

Body Height:

120.6 mm

Body Length/Diameter:

31.8 mm

Housing:

STAINLESS STEEL

Maximum Measurement Range (mm):

1.27 mm

Minimum Measurement Range (mm):

.12 mm

Output Type:

Package Shape or Style:

Sensors or Transducers Type:

Termination Type:

CABLE

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

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