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5962-9087901MVX

NXP Semiconductors

5962-9087901MVX by NXP Semiconductors

SIGNAL CONDITIONER; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

5962-9087901MVX by NXP Semiconductors
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,389 parts In-Stock

1+ parts

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4,389

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Vyrian

USA . 212 parts In-Stock

1+ parts

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212

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Anansix

USA . 153 parts In-Stock

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153

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Distributors (Availability)

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Native Components

USA . 307 parts In-Stock

1+ parts

$0.851

100+ parts

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307

$0.851

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Northwest PG Solutions

USA . 2,377 parts In-Stock

1+ parts

$0.937

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2,377

$0.937

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One Stop Electronics

USA . 1,220 parts In-Stock

1+ parts

$13.000

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1,220

$13.000

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Corphita

USA . 4,663 parts In-Stock

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4,663

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UNI Independent Distributors

Spain . 1,902 parts In-Stock

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Technical Specifications

Data Acquisition ADCs & DACs 5962-9087901MVX attributes and parameters. Explore more Data Acquisition ADCs & DACs devices from NXP Semiconductors

Converter Specifications

Converter Type:

No. of Functions:

1

Electrical Characteristics

Nominal Supply Voltage:

10 V

Operating Conditions

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Form Factor

Terminal Form:

Terminal Position:

Dual

No. of Terminals:

18

Surface Mount:

No

Packaging

Package Style:

In-Line

Package Shape:

Package Code:

DIP

Standards and Codes

JESD-30 Code:

R-XDIP-T18

Qualified:

No

Screening Level:

MIL-STD-883

Trade Compliance

5962-9087901MVX Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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