Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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DFB LASER MODULE EMITTER; Mounting Feature: PANEL MOUNT; Maximum Supply Voltage: 1.6 V; Maximum Operating Temperature: 85 Cel; Minimum Operating Temperature: -20 Cel; Fiber Type: SMF;
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Fiber Optics - Emitters NX8508BM49-CC-A attributes and parameters. Explore more Fiber Optics - Emitters devices from Nec Compound Semiconductor Devices
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Tokyo, March 14, 2002 - NEC Compound Semiconductor Devices, Ltd. (NEC Compound Semiconductor Devices) and Sumitomo Electric Industries, Ltd. (SEI) today announced they have joined into a multi-source agreement (MSA) to set a common architecture for 10 Gigabit per second (Gbps) detector modules used in optical networking. Sample shipments will start from today of products based on this common standard. The new device is developed to work within the 1.3 micron ~ 1.55 micron wavelength range and is mounted with a amplifier on the industry's smallest class of metal ceramic packages (L x W x H = 9.8mm x 7.5mm x 4.0mm). This super-small module addresses the calls coming from the industry for downsizing of 10 Gbps optical network transceivers. The detector module facilitates conversion of optical signals to electric signals and is one of the essential devices for 10 Gbps digital transmissions over optical fiber networks. NEC Compound Semiconductor Devices, Ltd. (NEC Compound Semiconductor Devices) is a leading provider of opticaland microwave devices, committed to meeting the specialized needs of its customers in the broadband and mobile networking fields with its compound and silicon semiconductor technologies. NEC Compound Semiconductor Devices, was divided from NEC Corporation and established in October 2001.
SMBJ18CA
Hy Electronic
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317TG
Onsemi
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Minimum Input-Output Voltage Differential: 3 V; Qualification Status: Not Qualified; No. of Functions: 1;
LAN8720AI-CP-TR
Standard Microsystems
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
Lite-on Semiconductor
BAV99
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Plessey Semiconductors Discrete Components Div
LM358AN
Samsung
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
M39029/58-360
TE Connectivity
TE Connectivity's M39029/58-360 is a CRIMP terminal backshell for 22-28 AWG wires, rated at 5A. Ideal for male contacts in Mil-Spec applications, it offers a cross-section area of 0.34 mm2 and ensures secure connections in demanding environments.
LM107H/883C
National Semiconductor
LM107H/883C by National Semiconductor is a MILITARY-grade Operational Amplifier with +-5/+-15V supplies. Featuring 2000uV max input offset voltage, it operates from -55 to 125 °C. Ideal for applications requiring VOLTAGE-FEEDBACK architecture and frequency compensation.
1N4148
NXP Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM107H/883
Advanced Micro Devices
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Low-Offset: NO;
SS14
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MMSZ5245BT1G
MMSZ5245BT1G by Onsemi is a Zener diode with 15V nominal reference voltage, 8.5mA test current, and 16 ohm dynamic impedance. It is used in applications requiring precise voltage regulation in a compact SMD package for temperatures ranging from -55 to 150°C.
LL4148
TDK
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); No. of Phases: 1; No. of Elements: 1; Maximum Output Current: .2 A;
2N2222A
North American Philips Discrete Products Div
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BSS138
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Minimum DS Breakdown Voltage: 50 V; Maximum Operating Temperature: 150 Cel;
2N7002
Central Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .115 A; Maximum Drain Current (Abs) (ID): .115 A;
Panasonic
MIXER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 240; Terminal Finish: TIN LEAD;
NX8303CG-CC
Renesas Electronics
DFB LASER MODULE EMITTER; Mounting Feature: PANEL MOUNT, THROUGH HOLE MOUNT; Maximum Supply Voltage: 1.6 V; Connection Type: SC/UPC CONNECTOR; Maximum Operating Wavelength: 1335 nm; Communication Standard: TELCORDIA, ITU-T, SDH, STM-4;
NX8563LF413-BA
DFB LASER MODULE EMITTER; Mounting Feature: PANEL MOUNT; Package Style (Meter): BUTTERFLY; Body Length/Diameter: 20.83 mm; Minimum Threshold Current: 20 mA; Nominal Operating Wavelength: 1541 nm;
NX8530NH795
DFB LASER MODULE EMITTER; Maximum Supply Voltage: 2 V; Supply Current: 100 mA; Nominal Operating Wavelength: 1580 nm; Communication Standard: ITU-T; Rise Time: .12 ns;
NX8563LA445-CC
LASER DIODE MODULE EMITTER; Mounting Feature: PANEL MOUNT; Body Height: 7.8 mm; Built-in Features: ISOLATOR, TEC, THERMISTOR; Rise Time: .12 ns; Communication Standard: ITU-T;
NX8563LA541-CC
LASER DIODE MODULE EMITTER; Mounting Feature: PANEL MOUNT; Minimum Return Loss: 3 dB; Rise Time: .12 ns; Nominal Operating Wavelength: 1554 nm; Built-in Features: ISOLATOR, TEC, THERMISTOR;
NX8530NH811
DFB LASER MODULE EMITTER; Maximum Supply Voltage: 2 V; Minimum Return Loss: 3 dB; Maximum Fall Time: .12 ns; Body Length/Diameter: 5.8 mm; Nominal Operating Wavelength: 1581 nm;
OD-J6502-0B01
Fiber Optic Emitters; Mounting Feature: SURFACE MOUNT; Maximum Supply Voltage: 3.465 V; Maximum Operating Temperature: 75 Cel; Minimum Operating Temperature: 0 Cel;
STH51007G
Infineon Technologies
LASER DIODE EMITTER; Mounting Feature: PANEL MOUNT; Maximum Supply Voltage: 2.2 V; Maximum Operating Temperature: 85 Cel; Minimum Operating Temperature: -40 Cel; Body Height: 8.2 mm;
NX7535AN-AA
LASER DIODE MODULE EMITTER; Mounting Feature: THROUGH HOLE MOUNT; Terminal Finish: Tin/Lead (Sn/Pb); Body Length/Diameter: 5.95 mm; No. of Channels: 1; Built-in Features: MONITOR PHOTODIODE;
NDL7451P1
LASER DIODE MODULE EMITTER; Mounting Feature: PANEL MOUNT, THROUGH HOLE MOUNT; Maximum Supply Voltage: 1.3 V; Maximum Operating Temperature: 85 Cel; Minimum Operating Temperature: -40 Cel; Spectral Width: 3 nm;
NX8563LA429-CC
LASER DIODE MODULE EMITTER; Mounting Feature: PANEL MOUNT; Body Length/Diameter: 20.83 mm; Supply Current: 125 mA; Communication Standard: ITU-T; Connection Type: SC/UPC CONNECTOR;
NX8563LF429-BA
DFB LASER MODULE EMITTER; Mounting Feature: PANEL MOUNT; Built-in Features: ISOLATOR, LASER DIODE, TEC, THERMISTOR; Communication Standard: ITU-T; Body Height: 7.5 mm; Connection Type: FC/PC CONNECTOR;
NX8508BM59-CC-A
DFB LASER MODULE EMITTER; Mounting Feature: PANEL MOUNT; Maximum Supply Voltage: 1.6 V; Terminal Finish: Tin/Bismuth (Sn/Bi); Maximum Operating Temperature: 85 Cel; Minimum Operating Temperature: -20 Cel;
NX8531NH646
DFB LASER MODULE EMITTER; Maximum Supply Voltage: 2 V; Minimum Return Loss: 3 dB; Body Height: 18.5 mm; Minimum Supply Voltage: .9 V; Communication Standard: ITU-T;
NX8563LA573-CC
LASER DIODE MODULE EMITTER; Mounting Feature: PANEL MOUNT; Communication Standard: ITU-T; Fiber Type: SMF; Built-in Features: ISOLATOR, TEC, THERMISTOR; Connection Type: SC/UPC CONNECTOR;
NX8563LA373-CD
LASER DIODE MODULE EMITTER; Mounting Feature: PANEL MOUNT; Communication Standard: ITU-T; Body Height: 7.8 mm; Supply Current: 125 mA; Minimum Operating Wavelength: 1530 nm;
STM51004G
LASER DIODE EMITTER; Mounting Feature: PANEL MOUNT; Maximum Supply Voltage: 1.5 V; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 85 Cel; Minimum Operating Temperature: -40 Cel;
NDL7460P1D
LASER DIODE MODULE EMITTER; Mounting Feature: PANEL MOUNT, THROUGH HOLE MOUNT; Maximum Operating Temperature: 85 Cel; Minimum Operating Temperature: -40 Cel; Minimum Operating Wavelength: 1260 nm; Maximum Operating Wavelength: 1360 nm;
NDL5033P
LASER DIODE MODULE EMITTER; Mounting Feature: PANEL MOUNT, THROUGH HOLE MOUNT; Maximum Operating Temperature: 60 Cel; Minimum Operating Temperature: 0 Cel; Nominal Operating Wavelength: 1303 nm; Additional Features: IT ALSO OPERATES AT 1270 NM TO 1330 NM WAVELENGTH, IT ALSO HAVE A THRESHOLD CURRENT OF 20 MA, IT ALSO HAVE A SPECTRAL WIDTH OF 6 NM;
NX8530NH557
DFB LASER MODULE EMITTER; Maximum Supply Voltage: 2 V; Body Length/Diameter: 5.8 mm; Additional Features: IT ALSO HAVE RETURN LOSS OF 6 DB; Maximum Fall Time: .12 ns; Body Height: 18.5 mm;
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