Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 52; Package Code: DIE; Package Shape: RECTANGULAR;
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AZTECH Wire
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$35.534
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$189.129
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Perfect Parts
Secondary Storage Controllers MTFDDAT256MBF-1AN12ABYY attributes and parameters. Explore more Secondary Storage Controllers devices from Micron Technology
Additional Features:
Maximum Data Transfer Rate:
Maximum Host Data Transfer Rate:
Host Interface Standard:
JESD-30 Code:
Length:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Maximum Seated Height:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Temperature Grade:
Terminal Form:
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Width:
Peripheral IC Type:
MTFDDAT256MBF-1AN12ABYY Peripheral ICs trade compliance attributes, and parameters.
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Packaging - Label 12/Sep/2016 Standard Pkg Label Chg 20/Feb/2019
Micron Technology, Inc. is a leading provider of cutting-edge semiconductor solutions and products, based in Boise, Idaho. Founded in 1978, the company manufactures dynamic random-access memory (DRAM), flash memory, USB flash drives and other storage solutions used by a wide range of businesses and consumers around the world. With more than 35,000 employees worldwide and a $20 billion market capitalization as of 2019, Micron has remained at the forefront of technological innovation for over 40 years. The company's products are used in enterprise applications such as networking and data centers; mobile computing devices including smartphones and tablets; personal computers; automotive electronics; embedded systems; gaming consoles; imaging systems; industrial manufacturing processes; medical devices; military systems and more.
President, CEO
Sanjay Mehrotra
Executive VP, CFO
Mark J. Murphy
Executive VP, CBO
Sumit Sadana
Fab 4
Fabrication
Fab Initiation
1994
USA
Boise
Wafer Capacity
8,750
Fab 6
1997
Manassas
23,000
2006
28,000
Fab 11
2007
Taiwan
Taoyuan
34,000
Fab 16 A1
Taichung
50,000
Fab 16 A3
2021
3,000
Fab 15
2002
Japan
Hiroshima
98,000
2004
New Hiroshima DRAM Fab
2017
11,750
Fab 10W
2016
Singapore
20,000
Fab 10X
55,000
2019
18,000
Fab 10A
Fab 10N
2014
47,000
2000
32,000
2012
6,000
Fab 16 A2
2015
43,000
New Clay Fab Phase 1
2027
Clay
New Boise Fab 1
2025
Fab 16 A5
2028
Expansion Fab
2020
EPCS4SI8N
Altera
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
1N4148W-T
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Micro Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SMBJ18CA
KYOCERA AVX
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138W-7-F
Diodes Incorporated
Diodes Inc.'s BSS138W-7-F is a N-channel FET with 50V DS breakdown voltage, ideal for switching applications. It features single configuration with built-in diode, Gull Wing terminals, and operates in enhancement mode. With 0.2A max drain current and 3.5 ohm RDS(on), it's UL recognized and suitable for small outline packages at temperatures ranging from -55 to 150°C.
2N7002
Inter F E T
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 7.5 ohm; Maximum Drain Current (Abs) (ID): .115 A;
USB3320C-EZK-TR
Standard Microsystems
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
CRCW06030000Z0EAHP
Vishay Intertechnology
Vishay Intertechnology's CRCW06030000Z0EAHP is a 0 ohm jumper resistor with METAL GLAZE/THICK FILM tech. Operating temp range -55 to 155 °C, it's SMT package style makes it ideal for automotive applications meeting AEC-Q200 standard.
Nte Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Power Dissipation (Abs): 1 W; Maximum Collector Current (IC): .8 A; Terminal Form: WIRE;
FDLL4148
National Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
ERJ3EKF1002V
Panasonic
Panasonic's ERJ3EKF1002V is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. It operates b/w -55 to 155 °C and is ideal for surface mount applications in automotive electronics due to AEC-Q200 compliance.
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Time At Peak Reflow Temperature (s): 30; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
ISO1050DUBR
Texas Instruments
ISO1050DUBR by Texas Instruments is a network interface IC with 8 terminals, operating from -55 to 105°C. It features a small outline package, nickel palladium gold finish, and gull wing terminal form. Ideal for telecom applications requiring a 5V supply voltage and peak reflow temperature of 260°C.
BSS138
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3 ohm; Minimum DS Breakdown Voltage: 50 V; Terminal Form: GULL WING;
PIC18F4550T-I/PT
Microchip Technology
The Microchip Technology PIC18F4550T-I/PT microcontroller operates at a max clock frequency of 48 MHz with 8-bit architecture. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it suitable for industrial applications requiring high-speed data processing and analog-to-digital conversion. With low power mode and flash ROM programmability, this device offers efficient performance in compact designs.
USBLC6-2SC6
STMicroelectronics
USBLC6-2SC6 by STMicroelectronics is a unidirectional transient voltage suppressor diode with a breakdown voltage of 6V. It has a max clamping voltage of 17V and operates in temperatures ranging from -40 to 125°C. This device, with dual terminals and matte tin finish, is ideal for protecting sensitive electronics from voltage spikes in various applications.
MBRS130LT3G
Onsemi
MBRS130LT3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.445V. It operates b/w -65 to 125°C, has a reverse test voltage of 30V, and is ideal for power applications due to its small outline package style.
FDN5618P
FDN5618P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage. It features a single configuration with built-in diode, suitable for switching applications. With 10A IDM and 0.17 ohm RDS(on), it operates in the temperature range of -55 to 150 °C, making it ideal for various electronic devices.
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum Operating Temperature: -65 Cel; Terminal Position: BOTTOM;
M39029/58360
Souriau
CONNECTOR ACCESSORY; Associated Military - Specifications: MIL-DTL-38999; Tool Settings: M22520/2-09; Terminal Type: CRIMP; MIL Conformity: YES; Mating Contacts: M39029/56348;
MTFDDAK800MBB-1AE16ABYY
Micron Technology
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 22; Package Code: DIE; Package Shape: RECTANGULAR;
TC8566AF
Toshiba
SECONDARY STORAGE CONTROLLER, FLOPPY DISK DRIVE; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: RECTANGULAR;
THNSNC064GAMJ
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; Package Shape: RECTANGULAR; Maximum Supply Voltage: 3.465 V; Maximum Operating Temperature: 70 Cel;
PX04SVB384
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; Package Shape: RECTANGULAR; Maximum Supply Voltage: 5.35 V; Package Style (Meter): MICROELECTRONIC ASSEMBLY;
THGBMFG8C4LBAIR
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR;
UPD72069L
Renesas Electronics
Secondary Storage Controllers; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 84; Package Code: QCCJ; Package Shape: SQUARE;
PX04SVQ048
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; Package Shape: RECTANGULAR; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Terminal Position: UNSPECIFIED;
MTFDDAK256MAZ-1AE1ZABYY
MTFDDAK7T6TBY-1AR16ABYY
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Technology: CMOS; Peak Reflow Temperature (C): NOT SPECIFIED;
MTFDDAV128MAZ-1AE1ZZZYY
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 75; Package Code: DIE; Package Shape: RECTANGULAR;
MTFDBAC240MAE-1C1
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Temperature Grade: COMMERCIAL; Terminal Form: UNSPECIFIED; Package Shape: RECTANGULAR; Terminal Position: UNSPECIFIED; Surface Mount: NO;
MTFDDAT256MBF-1AN12ABYY
MTEDCBE002SAJ-1M2
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 10; Package Shape: RECTANGULAR; Surface Mount: YES;
UPD7262D12
Secondary Storage Controllers; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 40; Package Code: DIP; Package Shape: RECTANGULAR;
PX04SVQ384
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; Package Shape: RECTANGULAR; Surface Mount: YES; Package Style (Meter): MICROELECTRONIC ASSEMBLY;
THNSFC064GBSJ
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED; Technology: CMOS;
SDIN2C2-2G
Sandisk
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 169; Package Code: TFBGA; Package Shape: RECTANGULAR;
MTFDDAK256MAZ-1AE1ZACYY
MTFDDAK7T6TBY-1AR1ZABYY
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Peak Reflow Temperature (C): NOT SPECIFIED; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Technology: CMOS;
THGBMFT0CBLBAIS
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
MTFDDAK480TDS-1AW1ZABYY
Secondary Storage Controllers;
MTFDDAV256TBN-1AR12ABYY
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Technology: CMOS;
MTFDDAV256TBN-1AR1ZABYY
MTFDDAV256TBN-1AR12TAYY
MTFDDAK1T9TDT-1AW1ZABYY
MTFDDAK240TDS-1AW1ZABYY
MTFDDAV960TDS-1AW1ZABYY
MTFDDAK240MBB-1AE1ZABYY
MTFDDAK240TCB-1AR1ZABYY
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED; Technology: CMOS;
MTFDDAV240TCB-1AR1ZABYY
MTFDDAK1T9TDS-1AW1ZABYY
MTFDDAV1T9TDS-1AW1ZABYY
MTFDDAK480TDT-1AW15ABYY
MTFDCAE008SAJ-1M1IT
SECONDARY STORAGE CONTROLLER, FLOPPY DISK DRIVE; Temperature Grade: INDUSTRIAL; Terminal Form: UNSPECIFIED; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260; JESD-30 Code: R-XXMA-X;
MTFDBAC240MAE-1C1IT
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Temperature Grade: INDUSTRIAL; Terminal Form: UNSPECIFIED; Package Shape: RECTANGULAR; Surface Mount: NO; Technology: CMOS;
MTFDCAE008SAJ-1N1IT
SECONDARY STORAGE CONTROLLER, FLOPPY DISK DRIVE; Temperature Grade: INDUSTRIAL; Terminal Form: UNSPECIFIED; Package Shape: RECTANGULAR; Host Interface Standard: USB; Qualification: Not Qualified;
MTFDCAE016SAJ-1M1
SECONDARY STORAGE CONTROLLER, FLOPPY DISK DRIVE; Temperature Grade: COMMERCIAL; Terminal Form: UNSPECIFIED; Package Shape: RECTANGULAR; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Host Interface Standard: USB;
MTFDBAC060MAE-1C1IT
SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE; Temperature Grade: INDUSTRIAL; Terminal Form: UNSPECIFIED; Package Shape: RECTANGULAR; Maximum Seated Height: 9.5 mm; Nominal Supply Voltage: 5 V;
MTFDCAE002SAJ-1M1IT
SECONDARY STORAGE CONTROLLER, FLOPPY DISK DRIVE; Temperature Grade: INDUSTRIAL; Terminal Form: UNSPECIFIED; Package Shape: RECTANGULAR; Qualification: Not Qualified; Maximum Operating Temperature: 85 Cel;
MTFDCAE016SAJ-1M1IT
SECONDARY STORAGE CONTROLLER, FLOPPY DISK DRIVE; Temperature Grade: INDUSTRIAL; Terminal Form: UNSPECIFIED; Package Shape: RECTANGULAR; Maximum Time At Peak Reflow Temperature (s): 30; Technology: CMOS;
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