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VSC8489YJU-13

Microchip Technology

VSC8489YJU-13 by Microchip Technology

Microchip Technology's VSC8489YJU-13 is an Ethernet transceiver with 196 terminals in a square grid array package. Operating temperature ranges from -40 to 110°C, suitable for industrial use. It has a low profile design, surface mountable, and ideal for network interfaces.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,362 parts In-Stock

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5,362

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Nova Conductors

Japan . 79 parts In-Stock

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79

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Distributors (Availability)

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AZTECH Wire

Italy . 809 parts In-Stock

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$12.392

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809

$12.392

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Ampacity Inc.

Singapore . 1,254 parts In-Stock

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$819.000

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$819.000

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LOOK Integrated Logistics

Peru . 8,321 parts In-Stock

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8,321

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LMD Electronica

Estonia . 5,586 parts In-Stock

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Montano Global Distributors

Canada . 3,175 parts In-Stock

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Vigor

Singapore . 2,750 parts In-Stock

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2,750

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NIA Electronics

USA . 2,524 parts In-Stock

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2,524

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Ledger Components

France . 2,524 parts In-Stock

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Microchip USA

USA . 2,086 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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Continental Prestige Electronics

USA . 593 parts In-Stock

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Argo Parts USA

USA . 317 parts In-Stock

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317

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Speed Components Ltd (Excess)

Israel . 50 parts In-Stock

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50

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Overview

Unlock the power of seamless networking with the VSC8489YJU-13 by Microchip Technology. Crafted with precision and expertise, this Ethernet transceiver offers unparalleled quality and reliability. Ideal for a wide range of applications, this network interface device is designed to elevate your connectivity experience. Experience the value of cutting-edge technology and superior performance with the VSC8489YJU-13, where innovation meets excellence. Elevate your networking solutions with Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, perfect for portable devices.

Surface Mount: YES

Easy to install and saves space on the PCB due to surface mounting.

Package Shape: SQUARE

The square shape allows for efficient use of space on the PCB.

No. of Terminals: 196

Provides a high level of connectivity options for various network interfaces and devices.

Temperature Grade: INDUSTRIAL

Can withstand a wide range of temperatures, making it suitable for industrial applications.

Nominal Supply Voltage: 1 V

Operates efficiently at a low supply voltage, reducing power consumption.

Technical Specifications

Network Interfaces VSC8489YJU-13 attributes and parameters. Explore more Network Interfaces devices from Microchip Technology

Specs

JESD-30 Code:

S-PBGA-B196

Length:

15 mm

No. of Functions:

1

No. of Terminals:

196

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Maximum Seated Height:

1.4 mm

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

15 mm

Trade Compliance

VSC8489YJU-13 Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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