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VCC1-B3F-100M000000TR

Microchip Technology

VCC1-B3F-100M000000TR by Microchip Technology

CMOS; Mounting Feature: SURFACE MOUNT; No. of Terminals: 4; Frequency Stability: 25 %; Frequency Adjustment (Mechanical): NO; Package Equivalence Code: DILCC4,.2,200;

Median Price

-

Lifecycle Status

Suppliers In-Stock

0

In-Stock Inventory

< 1k

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

RGB Technical Solutions

Ukraine . 5,989 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,989

-

-

-

-

Technical Specifications

XO Clock Oscillators VCC1-B3F-100M000000TR attributes and parameters. Explore more XO Clock Oscillators devices from Microchip Technology

Specs

Additional Features:

TRI-STATE; ENABLE/DISABLE FUNCTION

Maximum Fall Time:

2 ns

Frequency Adjustment (Mechanical):

NO

Frequency Stability:

JESD-609 Code:

e4

Mounting Feature:

No. of Terminals:

4

Nominal Operating Frequency:

100 MHz

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Oscillator Type:

Output Load:

15 pF

Package Equivalence Code:

DILCC4,.2,200

Physical Dimension:

7mm x 5mm x 1.6mm

Maximum Rise Time:

2 ms

Screening Level:

MIL-STD-883

Maximum Supply Current:

50 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3.3 V

Maximum Symmetry (%):

45/55

Terminal Finish:

Gold (Au) - with Nickel (Ni) barrier

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

Authentic purchasing experiences

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