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VC-709-HDE-FAAN-66M6670000

Microchip Technology

VC-709-HDE-FAAN-66M6670000 by Microchip Technology

Microchip Technology's VC-709-HDE-FAAN-66M6670000 is a LVDS XO Clock Oscillator with 25% frequency stability at 66.667 MHz. It operates b/w -40 to 85 °C, with a rise time of 0.4 ms and fall time of 0.4 ns. Ideal for applications requiring precise timing in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,289 parts In-Stock

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Nova Conductors

Japan . 28 parts In-Stock

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Ampacity Inc.

Singapore . 1,089 parts In-Stock

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$0.010

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1,089

$0.010

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Corohmni

South Africa . 1,202 parts In-Stock

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$1.854

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AZTECH Wire

Italy . 669 parts In-Stock

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$18.000

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669

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West Coast Incorporated

USA . 1,204 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Netroflash

USA . 100 parts In-Stock

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100

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Overview

Discover the superior quality and reliability of the VC-709-HDE-FAAN-66M6670000 by Microchip Technology, a cutting-edge XO Clock Oscillator designed to meet your timing needs with precision. This high-performance oscillator offers unmatched frequency stability and is suitable for a wide range of applications. With its compact size and LVDS technology, it provides exceptional value and benefits for your projects, delivering consistent and accurate performance. Trust in Microchip Technology's expertise and elevate your designs with the VC-709-HDE-FAAN-66M6670000.

Feature Benefit Bullets

Frequency Stability: 25%

This clock oscillator provides a stable frequency output, ensuring accurate timing for various applications.

Maximum Supply Voltage: 2.625 V

With a higher maximum supply voltage, this oscillator can handle fluctuations without compromising performance.

Output Load: 100 OHM

Suitable for driving standard 100 OHM loads, making it compatible with a wide range of systems.

Nominal Supply Voltage: 2.5 V

Operating at the standard 2.5 V supply voltage, this oscillator is easy to integrate into existing setups.

Oscillator Type: LVDS

Low Voltage Differential Signaling (LVDS) ensures high-speed data transmission with low power consumption.

Maximum Rise Time: 0.4 ms

Fast rise time allows for quick signal transitions, ideal for applications requiring precise timing.

Physical Dimension: 7.0mm x 5.0mm x 1.7mm

Compact size makes it easy to fit into space-constrained designs without compromising performance.

Minimum Supply Voltage: 2.375 V

Can operate at lower supply voltages, providing flexibility in power supply options.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, suitable for demanding environments.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures reliable performance even in extreme cold conditions.

Nominal Operating Frequency: 66.667 MHz

The specific operating frequency makes it suitable for applications requiring precise timing at this frequency.

Maximum Fall Time: 0.4 ns

Quick fall time complements the fast rise time, allowing for efficient signal transitions.

Maximum Symmetry (%): 55/45

High symmetry ensures balanced signal output, critical for synchronous applications.

Mounting Feature: SURFACE MOUNT

Surface mount capability simplifies the installation process, saving time and effort in assembly.

Technical Specifications

XO Clock Oscillators VC-709-HDE-FAAN-66M6670000 attributes and parameters. Explore more XO Clock Oscillators devices from Microchip Technology

Specs

Additional Features:

ENABLE/DISABLE FUNCTION; COMPLEMENTARY OPUTPUT; TAPE

Maximum Fall Time:

.4 ns

Frequency Adjustment (Mechanical):

NO

Frequency Stability:

Mounting Feature:

Nominal Operating Frequency:

66.667 MHz

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Oscillator Type:

Output Load:

100 OHM

Physical Dimension:

7.0mm x 5.0mm x 1.7mm

Maximum Rise Time:

.4 ms

Maximum Supply Voltage:

2.625 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Maximum Symmetry (%):

55/45

Trade Compliance

VC-709-HDE-FAAN-66M6670000 Oscillators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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