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UCS1002-2-BP-TR

Microchip Technology

UCS1002-2-BP-TR by Microchip Technology

POWER SUPPLY SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 20; Package Code: HVQCCN; Package Shape: SQUARE; Surface Mount: YES;

Median Price

$2.255

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 4,019 parts In-Stock

1+ parts

$2.100

100+ parts

$1.940

1k+ parts

-

10k+ parts

$1.930

4,019

$2.100

$1.940

-

$1.930

DigiKey

USA . 24,896 parts In-Stock

1+ parts

$2.410

100+ parts

$1.938

1k+ parts

-

10k+ parts

$1.938

24,896

$2.410

$1.938

-

$1.938

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 16,738 parts In-Stock

1+ parts

$2.360

100+ parts

$1.900

1k+ parts

$1.900

10k+ parts

$1.900

16,738

$2.360

$1.900

$1.900

$1.900

Epart123

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.800

15,000

-

-

-

$1.800

Marpe Global Electronics

Taiwan . 8,285 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,285

-

-

-

-

QualityLine Systems

Poland . 8,285 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,285

-

-

-

-

XL Components Corporation

Australia . 8,285 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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8,285

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-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 6,988 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,988

-

-

-

-

Kepictronics

USA . 3,005 parts In-Stock

1+ parts

-

100+ parts

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3,005

-

-

-

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Metaverse IC Inc.

Canada . 630 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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630

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-

-

Authorized Procurement Solutions

USA . 200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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200

-

-

-

-

Technical Specifications

Power Management ICs UCS1002-2-BP-TR attributes and parameters. Explore more Power Management ICs devices from Microchip Technology

Specs

Adjustable Threshold:

YES

JESD-30 Code:

S-XQCC-N20

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.75 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Nominal Threshold Voltage (V):

2.5

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

4 mm

Trade Compliance

UCS1002-2-BP-TR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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