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TC1108-3.3VDB

Microchip Technology

TC1108-3.3VDB by Microchip Technology

TC1108-3.3VDB by Microchip Technology is a fixed positive single output LDO regulator with a nominal output voltage of 3.3 V and max output current of 0.3 A. It operates in an extended temperature range from -40 to 125°C, making it suitable for various applications requiring stable voltage regulation in compact designs. The package style is small outline with gull wing terminals, ideal for surface mount assembly in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Vyrian

USA . 430 parts In-Stock

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430

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Nova Conductors

Japan . 31 parts In-Stock

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31

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,471 parts In-Stock

1+ parts

$2.619

100+ parts

-

1k+ parts

$2.514

10k+ parts

$2.514

1,471

$2.619

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$2.514

$2.514

AZTECH Wire

Italy . 430 parts In-Stock

1+ parts

$7.303

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430

$7.303

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West Coast Incorporated

USA . 1,294 parts In-Stock

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1,294

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Kepictronics

USA . 419 parts In-Stock

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419

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Overview

Elevate your electronic projects with the TC1108-3.3VDB by Microchip Technology. Known for its high-quality fixed regulators, this LDO offers a reliable and efficient power solution for various applications. With a compact design and excellent voltage tolerance, this regulator ensures stable performance while minimizing dropout voltage. Whether you're designing consumer electronics or industrial equipment, the TC1108-3.3VDB delivers consistent power output, making it an essential component for any project. Upgrade your designs today with Microchip Technology's top-of-the-line regulator.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and helps in protecting the internal components of the regulator, making it a reliable choice for long-term usage.

Maximum Dropout Voltage-1: 1.48 V

Low dropout voltage ensures efficient power conversion with minimal loss, making it suitable for applications where power efficiency is crucial.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly process.

Operating Temperature (TJ-Max): 125 °C

Wide operating temperature range makes it suitable for use in various environmental conditions without compromising performance.

Technology: CMOS

CMOS technology enables low power consumption, making the regulator energy-efficient and ideal for battery-powered applications.

Package Shape: RECTANGULAR

Rectangular package shape provides easy mounting and handling, making it convenient for installation in electronic devices.

Terminal Form: GULL WING

Gull wing terminal form ensures secure connection and reliable electrical contact, enhancing the overall stability of the regulator.

Operating Temperature (TJ-Min): -40 °C

Wide temperature range allows for operation in harsh environments with extreme cold conditions, making it versatile and durable.

Packing Method: TUBE

Tube packing method offers protection during transportation and storage, preventing damage and ensuring the regulator arrives in optimal condition.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

Being a fixed positive output LDO regulator ensures stable and precise voltage regulation, making it reliable for sensitive electronic components.

Technical Specifications

Fixed Regulators - Positive Single Output LDO TC1108-3.3VDB attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from Microchip Technology

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.48 V

Nominal Dropout Voltage-1:

.24 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

6 V

Minimum Input Voltage:

3.78 V

JESD-30 Code:

R-PDSO-G4

JESD-609 Code:

e3

Length:

6.5 mm

Maximum Line Regulation:

.01155 %

Maximum Load Regulation:

.066 %

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

4

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.3 A

Maximum Output Voltage-1:

3.3825 V

Minimum Output Voltage-1:

3.2175 V

Nominal Output Voltage-1:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOT-223

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

1.8 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.3 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

Width:

3.5 mm

Trade Compliance

TC1108-3.3VDB Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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