Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Featured manufacturers
SY10EP51VKG-TR by Microchip: ECL tech, 3.3V Vsup, 0.37ns tpd. Ideal for industrial applications requiring fast positive edge triggering in a compact square package with 8 terminals and complementary output polarity.
Median Price
$3.405
Lifecycle Status
Suppliers In-Stock
4
In-Stock Inventory
1k+
Microchip Technology
1+ parts
$3.770
100+ parts
$2.860
1k+ parts
$2.760
10k+ parts
$2.730
Rochester
-
$3.040
$2.720
$2.560
NAC Semi
$3.570
$3.240
$2.960
Contempo Components LLC
QUARKTWIN TECHNOLOGY LTD
West Coast Incorporated
Authorized Procurement Solutions
Kepictronics
Metaverse IC Inc.
Assy Fe
The plastic/epoxy material used for the package body is lightweight and durable, making it suitable for various applications.
Being surface mountable allows for easier and more efficient assembly onto circuit boards, saving time and resources.
The 3.3V supply voltage is a common standard in many electronic devices, ensuring compatibility with a wide range of systems.
The very low propagation delay of just 0.37 ns ensures fast and efficient operation of the latch or flip-flop.
The positive edge trigger type ensures precise and reliable operation of the latch or flip-flop in response to input signals.
The compact 3mm width of the package makes it suitable for space-constrained applications where size is a critical factor.
The complementary output polarity allows for flexible and versatile integration with other components in a circuit.
The industrial temperature grade ensures reliable performance in a wide range of temperature environments, making it a suitable choice for industrial applications.
The high minimum fmax of 3000 MHz indicates the fast switching speed and high frequency capabilities of the latch or flip-flop.
Latches & Flip-Flops SY10EP51VKG-TR attributes and parameters. Explore more Latches & Flip-Flops devices from Microchip Technology
Additional Features:
Family:
JESD-30 Code:
JESD-609 Code:
Length:
Logic IC Type:
Moisture Sensitivity Level (MSL):
No. of Bits:
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Output Polarity:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Packing Method:
Peak Reflow Temperature (C):
Propagation Delay (tpd):
Qualification:
Maximum Seated Height:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
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Maximum Time At Peak Reflow Temperature (s):
Trigger Type:
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SY10EP51VKG-TR Logic ICs trade compliance attributes, and parameters.
ECCN
5A991.B.1
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Assembly/Origin - Wafer Size Update 02/Sep/2015
PCN Packaging - Packing Changes 10/Oct/2016
PCN Part Number - Micrel to Microchip PN Changes 7/Oct/2015
Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.
President and CEO
Ganesh Moorthy
Executive Chair
Steve Sanghi
CFO, Senior VP
J. Eric Bjornholt
Fab 5 - Colorado
Fabrication
Fab Initiation
1995
USA
Colorado Springs
Wafer Capacity
70,000
Santa Clara
1990
1,290
Lawrence
1989
5,000
Fab 4 - Gresham
1988
Gresham
50,000
Fab 2 - Tempe
1994
Tempe
30,000
Beverly
1985
2,000
Lowell
1986
15,000
Garden Grove
12,000
New Fab - Gresham
2024
FDN5618P
Onsemi
FDN5618P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage. It features a single configuration with built-in diode, suitable for switching applications. With 10A IDM and 0.17 ohm RDS(on), it operates in the temperature range of -55 to 150 °C, making it ideal for various electronic devices.
BSS123NH6327XTSA1
Infineon Technologies
Infineon BSS123NH6327XTSA1 is a N-CHANNEL FET with 100V DS breakdown voltage, 0.19A ID, and 6 ohm RDS(on). Ideal for small outline applications requiring high drain current and low on-resistance. AEC-Q101 compliant for automotive use.
1N4148
Hy Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
FDC5614P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.6 W; Transistor Application: SWITCHING; Maximum Drain Current (ID): 3 A;
LM358AN
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Weitronic Enterprise
BAV99
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
FDV303N
FDV303N by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, 0.68A Drain Current, and 0.45 ohm On Resistance. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at temperatures ranging from -55 to 150°C. Package style is SMALL OUTLINE with GULL WING terminals for surface mount assembly.
LM317T
STMicroelectronics
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; JESD-30 Code: R-XSFM-T3; Minimum Input-Output Voltage Differential: 3 V;
MSKSEMI SEMICONDUCTOR
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 2 W; Transistor Element Material: SILICON; Minimum DS Breakdown Voltage: 60 V;
LD1117S33CTR
STMicroelectronics LD1117S33CTR is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 1.3A. It operates within an input voltage range of 4.75V to 15V, making it suitable for various applications requiring stable voltage regulation in compact designs. The device features low dropout voltage of 1.3V, high temperature operation up to 125°C, and small outline package style for space-constrained PCB layouts.
MBR0530T1G
MBR0530T1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.375V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring high-speed switching in compact electronic devices like smartphones and tablets. The package style is small outline with gull wing terminals for surface mount assembly.
SS14
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M24308/2-1F
Itt Cannon
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Additional Features: STANDARD: MIL-DTL-24308, POLARIZED; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Filter Feature: NO;
2N2222A
Vishay Sprague
NPN; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JEDEC-95 Code: TO-18; Maximum Collector-Emitter Voltage: 40 V;
Allegro MicroSystems
RECTIFIER DIODE; Terminal Position: END; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
EU2B-YS3303C
Idec
ROTARY SWITCH;
BAT54C-7-F
Diodes Incorporated
BAT54C-7-F by Diodes Inc. is a Schottky rectifier diode with common cathode, 2 elements, and max forward voltage of 0.24V. Ideal for applications requiring fast reverse recovery time of 0.005 us, such as in small outline packages for surface mount technology at temperatures ranging from -65 to 150°C.
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum Operating Temperature: -65 Cel; Terminal Position: BOTTOM;
74HCT74D,653
NXP Semiconductors
NXP Semiconductors' 74HCT74D,653 is a dual-function latch with 14 terminals and a supply voltage of 5V. It has a propagation delay of 53ns, operates b/w -40 to 125°C, and supports up to 18MHz frequency. Ideal for automotive applications due to its small outline package and positive edge trigger type.
74LCX112MTC
74LCX112MTC by Onsemi is a dual-function latch with a propagation delay of 7.5 ns and operates at a supply voltage of 2.5V, suitable for industrial applications. It features negative edge triggering, complementary output polarity, and can handle a max frequency of 150 MHz. Ideal for designs requiring fast response times in compact spaces.
5962-8955101FA
Teledyne E2v (uk)
J-K FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 16; Package Code: DFP; Package Shape: RECTANGULAR;
SN74HC112DRG4
Texas Instruments
SN74HC112DRG4 by Texas Instruments is a dual-function latches & flip-flops IC with 2 bits, operating at 5V. It has a propagation delay of 155ns and can handle load capacitance up to 50pF. Ideal for industrial applications requiring negative edge triggering and complementary output polarity.
CD4043BEX
Rochester Electronics
R-S LATCH; Temperature Grade: MILITARY; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
MC10EP51DTG
MC10EP51DTG by Onsemi is a latches & flip-flops IC with 0.37 ns propagation delay, 3.3V nominal voltage, and 3000000000 Hz max frequency. Ideal for industrial applications requiring positive edge trigger type, it operates b/w -40 to 85 °C with a compact square package design for surface mount assembly.
SN74LS74AN
SN74LS74AN by Texas Instruments is a TTL technology latch with 2 functions, 40 ns propagation delay, and 5V nominal voltage. It is used for positive edge triggering in commercial-grade applications requiring complementary output polarity and a max frequency of 25 MHz.
74LVX74MX
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
HEF4027BT,653
HEF4027BT,653 by NXP Semiconductors is a CMOS latch with 2 functions, operating at 5V. It has a propagation delay of 210ns and can handle load capacitance of 50pF. Ideal for industrial applications requiring positive edge trigger flip-flops in small outline packages.
CD74HC75PWR
CD74HC75PWR by Texas Instruments is a dual 2-bit latch with a propagation delay of 24 ns at 4.5V, suitable for military-grade applications. It features complementary output polarity, operates b/w -55 to 125°C, and has a max supply voltage of 6V. This small-outline IC is surface-mountable and ideal for high-level trigger applications.
SN74AHC74DR
SN74AHC74DR by Texas Instruments is a dual-function latch with 10.5ns propagation delay, ideal for automotive applications. It operates at a supply voltage range of 2-5.5V and has a max frequency of 75MHz. This CMOS technology flip-flop features positive edge triggering and complementary output polarity in a small outline package.
CD74HC73M
Harris Semiconductor
J-K FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
CD74AC174M
D FLIP-FLOP; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
CD4013BE
Rca Solid State
D FLIP-FLOP; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;
74LVC1G74DC-Q100,125
NXP Semiconductors' 74LVC1G74DC-Q100,125 is a CMOS latch with 13.4 ns propagation delay and operates b/w -40 to 125 °C. It features positive edge trigger, complementary output polarity, and AEC-Q100 screening level for automotive applications.
MC74HC112ADR2G
MC74HC112ADR2G by Onsemi is a dual flip-flop with 2 functions, operating at 5V. It has a load capacitance of 50pF and can handle up to 4A current. Ideal for military-grade applications requiring high-frequency operation up to 20MHz in small outline packages.
SN74LS75N
Motorola
D LATCH; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
SN74AUP1G79YZPR
SN74AUP1G79YZPR by Texas Instruments is a latches & flip-flops IC with 24 ns propagation delay at 1.2V, suitable for industrial applications. It features a max frequency of 260 MHz, operates b/w -40 to 85°C, and has a very thin profile grid array package style. With a low power supply current of 0.0009 mA and true output polarity, it offers reliable performance in compact designs.
SN74LVC1G74RSE2
SN74LVC1G74RSE2 by Texas Instruments is a CMOS latch with 5.9 ns propagation delay, suitable for automotive applications. It operates at 1.8V nominal voltage and has a max frequency of 200 MHz, making it ideal for high-speed circuit designs in compact spaces. With a low power supply current of 0.01 mA, this chip carrier is designed for surface mount assembly in tight layouts.
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