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SST26WF016BT-104I/MF

Microchip Technology

SST26WF016BT-104I/MF by Microchip Technology

SST26WF016BT-104I/MF by Microchip: NOR Flash Memory, 16MX1 organization, SPI serial bus type. Ideal for industrial applications with -40 to 85 °C operating temp range. Features 104 MHz clock frequency and 100000 write/erase cycles endurance.

Median Price

$2.550

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$2.550

100+ parts

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10

$2.550

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Vyrian

USA . 12,559 parts In-Stock

1+ parts

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12,559

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$2.499

100+ parts

-

1k+ parts

$2.399

10k+ parts

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1,000

$2.499

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$2.399

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Continental Prestige Electronics

USA . 4,741 parts In-Stock

1+ parts

$2.550

100+ parts

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$2.499

4,741

$2.550

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$2.499

Argo Parts USA

USA . 3,490 parts In-Stock

1+ parts

$2.550

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3,490

$2.550

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Ampacity Inc.

Singapore . 1,041 parts In-Stock

1+ parts

$9.000

100+ parts

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1,041

$9.000

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Microchip USA

USA . 4,635 parts In-Stock

1+ parts

$12.103

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4,635

$12.103

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AZTECH Wire

Italy . 669 parts In-Stock

1+ parts

$19.678

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669

$19.678

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Fulton Briggs Corp.

USA . 5,759 parts In-Stock

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5,759

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Overview

Unlock the power of reliable and high-quality flash memory with the Microchip Technology SST26WF016BT-104I/MF. With a focus on excellence, Microchip Technology delivers cutting-edge technology in a compact package suitable for a wide range of applications. Offering seamless operation at an impressive clock frequency of 104 MHz, this flash memory device provides fast and efficient data storage solutions. Trust in the durability and performance of Microchip Technology's products to enhance your projects and streamline your workflow. Elevate your work with the SST26WF016BT-104I/MF today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the flash memory, making it a reliable choice for long-term use.

Surface Mount: YES

The surface-mount capability allows for easy installation and integration into various electronic devices, making it a convenient option for manufacturers.

Screening Level: TS 16949

Compliance with TS 16949 screening level standards ensures high quality and reliability in the flash memory product, making it a dependable choice for industrial applications.

Package Shape: RECTANGULAR

The rectangular package shape offers a compact design that saves space and allows for efficient placement in electronic devices, making it a practical choice for compact designs.

Operating Mode: SYNCHRONOUS

The synchronous operating mode offers faster data transfer speeds and more efficient operation, making it an optimal choice for high-performance applications.

Nominal Supply Voltage / Vsup (V): 1.8

The nominal supply voltage of 1.8V provides efficient power consumption and compatibility with a wide range of devices, making it a versatile choice for different applications.

No. of Terminals: 8

The 8 terminals allow for easy connectivity and integration with other electronic components, making it a user-friendly choice for installation and use.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style offers efficient heat dissipation and space-saving design, making it a practical choice for compact electronic devices.

Maximum Operating Temperature: 85 °C

The maximum operating temperature of 85°C ensures reliable performance even in high-temperature environments, making it a durable choice for industrial applications.

Organization: 16MX1

The organization of 16MX1 provides a large memory capacity for storing data, making it a suitable choice for applications that require high storage capacity.

Output Characteristics: 3-STATE

The 3-state output characteristics allow for flexible control of data output, making it a versatile choice for different data processing applications.

Technical Specifications

Flash Memory SST26WF016BT-104I/MF attributes and parameters. Explore more Flash Memory devices from Microchip Technology

Specs

Maximum Clock Frequency (fCLK):

104 MHz

Minimum Data Retention Time:

100

Endurance:

100000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Length:

6 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

1

No. of Functions:

1

No. of Ports:

1

No. of Terminals:

8

No. of Words:

16777216 words

No. of Words Code:

16M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

16MX1

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Programming Voltage (V):

1.8

Screening Level:

TS 16949

Maximum Seated Height:

.8 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000005 Amp

Maximum Supply Current:

25 mA

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Type:

NOR TYPE

Width:

5 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

SST26WF016BT-104I/MF Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.A

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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