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SCH3222-SX-TR

Microchip Technology

SCH3222-SX-TR by Microchip Technology

SCH3222-SX-TR by Microchip: Serial Communication Controller with 3.63V max supply, 0.1875 MBps data rate, and 33 MHz clock freq. Ideal for sync/byte communication in commercial-grade applications requiring low power mode and PCI/UART bus compatibility.

Median Price

$3.440

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 5,900 parts In-Stock

1+ parts

$3.440

100+ parts

$2.610

1k+ parts

$2.400

10k+ parts

$2.290

5,900

$3.440

$2.610

$2.400

$2.290

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 2,857 parts In-Stock

1+ parts

$4.430

100+ parts

$2.082

1k+ parts

$1.905

10k+ parts

-

2,857

$4.430

$2.082

$1.905

-

Dan-Mar Components

USA . 2,857 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,857

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Fulton Briggs Corp.

USA . 1,876 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,876

-

-

-

-

Overview

Experience seamless communication with the SCH3222-SX-TR by Microchip Technology, a leading manufacturer in the industry. This serial communication controller offers reliability and efficiency, making it ideal for various applications. With a maximum data transfer rate of 0.1875 MBps and low power mode capability, this product ensures optimal performance while conserving energy. Trust in Microchip Technology to deliver top-notch quality and cutting-edge technology for all your communication needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that can withstand various environmental conditions.

Surface Mount: YES

Allows for easy and secure mounting on a PCB.

Maximum Supply Voltage: 3.63 V

Allows for flexibility in power supply options.

On Chip Data RAM Width: 8

Sufficient RAM width for storing and processing data efficiently.

Package Shape: SQUARE

Compact shape that saves space on the PCB.

No. of Terminals: 84

Sufficient terminals for connecting various components and peripherals.

Minimum Supply Voltage: 2.97 V

Wide range of supply voltage for compatibility with different power sources.

Maximum Operating Temperature: 70 °C

Can operate in a wide range of temperatures, suitable for diverse applications.

Maximum Data Transfer Rate: 0.1875 MBps

High data transfer rate for efficient communication with other devices.

Minimum Operating Temperature: 0 °C

Can operate in low-temperature environments without issues.

Terminal Position: BOTTOM

Easy access to terminals for installation and maintenance.

Maximum Seated Height: 0.8 mm

Low profile design for compact and slim devices.

RAM Words: 256

Sufficient memory capacity for storing data and instructions.

Width: 7 mm

Compact width for saving space on the PCB.

Communication Protocol: SYNC, BYTE

Supports multiple communication protocols for flexibility in data transfer.

Maximum Clock Frequency: 33 MHz

High clock frequency for fast processing of data.

Length: 7 mm

Compact length for space-saving on the PCB.

Temperature Grade: COMMERCIAL

Suitable for commercial applications that typically operate in standard temperature ranges.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER

Specifically designed for managing serial communications, ensuring reliable data transfer.

Technology: CMOS

Low power consumption and high noise immunity characteristics.

Terminal Form: BALL

Ball terminals for secure and reliable connections.

Maximum Supply Current: 1 mA

Low supply current for energy-efficient operation.

Nominal Supply Voltage: 3 V

Standard supply voltage for easy integration with power sources.

No. of Serial I/Os: 4

Multiple serial I/O ports for connecting to various devices.

Bus Compatibility: PCI; UART

Compatible with popular bus interfaces for seamless integration with existing systems.

Terminal Pitch: 0.65 mm

Fine terminal pitch for compact layout design on the PCB.

Low Power Mode: YES

Supports low power mode for energy-saving operation.

No. of I/O Lines: 23

Sufficient I/O lines for connecting to external peripherals and devices.

Technical Specifications

Serial Communication Controllers SCH3222-SX-TR attributes and parameters. Explore more Serial Communication Controllers devices from Microchip Technology

Specs

Address Bus Width:

0

Boundary Scan:

NO

Bus Compatibility:

PCI; UART

Maximum Clock Frequency:

33 MHz

Communication Protocol:

SYNC, BYTE

Maximum Data Transfer Rate:

.1875 MBps

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B84

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

0

No. of I/O Lines:

23

No. of Serial I/Os:

4

No. of Terminals:

84

On Chip Data RAM Width:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA84,10x10,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Words:

256

Maximum Seated Height:

.8 mm

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.63 V

Minimum Supply Voltage:

2.97 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

7 mm

Trade Compliance

SCH3222-SX-TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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