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RE46C144SW16F

Microchip Technology

RE46C144SW16F by Microchip Technology

RE46C144SW16F by Microchip Tech is a CMOS semiconductor with 16 terminals, operating b/w -25 to 70°C. It has a supply voltage of 9V and is surface-mountable in plastic/epoxy packaging. Ideal for applications requiring small outline packages and dual terminal positions.

Median Price

$1.096

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$1.096

100+ parts

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1k+ parts

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500

$1.096

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Vyrian

USA . 7,595 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,595

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R&J Components

USA . 100 parts In-Stock

1+ parts

-

100+ parts

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,118 parts In-Stock

1+ parts

$0.500

100+ parts

-

1k+ parts

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10k+ parts

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1,118

$0.500

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Continental Prestige Electronics

USA . 3,466 parts In-Stock

1+ parts

$1.096

100+ parts

-

1k+ parts

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10k+ parts

$1.074

3,466

$1.096

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$1.074

Argo Parts USA

USA . 1,706 parts In-Stock

1+ parts

$1.096

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1,706

$1.096

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Microchip USA

USA . 2,911 parts In-Stock

1+ parts

$7.150

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2,911

$7.150

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AZTECH Wire

Italy . 744 parts In-Stock

1+ parts

$13.177

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744

$13.177

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Lixinc

USA . 6,692 parts In-Stock

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6,692

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RGB Technical Solutions

Ukraine . 725 parts In-Stock

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725

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Overview

Elevate your electronic designs with the RE46C144SW16F by Microchip Technology. With a reputation for top-notch quality and reliability, Microchip Technology excels in creating innovative solutions like this small outline semiconductor. Ideal for a wide range of applications, this product offers customers unmatched value and benefits. From its durable plastic/epoxy package body material to its efficient CMOS technology, the RE46C144SW16F delivers exceptional performance at both high and low temperatures. Trust Microchip Technology to provide you with cutting-edge solutions for all your semiconductor needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, making the product easy to handle and long-lasting.

Surface Mount: YES

Surface mount technology allows for efficient and compact soldering of the component onto circuit boards, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

Rectangular shape provides a standardized form factor that fits well within existing circuit designs and layouts.

Nominal Supply Voltage (Vsup): 9 V

Operates at a common and easily obtainable voltage level, making it compatible with a wide range of power sources.

Maximum Operating Temperature: 70 °C

Capable of operating at a high temperature range, ensuring reliability and stability under demanding conditions.

Minimum Operating Temperature: -25 °C

Capable of operating at a low temperature range, making it suitable for use in various environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency and reliability of the product.

Technical Specifications

Other Function Semiconductors RE46C144SW16F attributes and parameters. Explore more Other Function Semiconductors devices from Microchip Technology

Specs

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

9

Qualification:

Not Qualified

Sub-Category:

Other Analog ICs

Nominal Supply Voltage (Vsup):

9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

RE46C144SW16F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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