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PL133-27GC-R

Microchip Technology

PL133-27GC-R by Microchip Technology

Microchip Technology's PL133-27GC-R clock driver is a small outline, heat sink package with 6 terminals. It operates b/w 0-70°C, suitable for commercial applications. With standard input conditioning and 2 true outputs, it supports a supply voltage range of 1.62-3.63V.

Median Price

$0.930

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 3,000 parts In-Stock

1+ parts

-

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$0.930

10k+ parts

$0.884

3,000

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-

$0.930

$0.884

Distributors (In-Stock)

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North Shore Components

USA . 7,490 parts In-Stock

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7,490

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IBS Electronics

USA . 3,000 parts In-Stock

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-

100+ parts

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$0.944

10k+ parts

$0.924

3,000

-

-

$0.944

$0.924

Electro Sonic

Canada . 1,750 parts In-Stock

1+ parts

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100+ parts

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$0.717

10k+ parts

$0.660

1,750

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-

$0.717

$0.660

Component Sense

UK . 535 parts In-Stock

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535

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Electronics Depot

USA . 29 parts In-Stock

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29

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Semtec, LLC

USA . 5 parts In-Stock

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Prism Electronics

USA . 5 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 93,136 parts In-Stock

1+ parts

$0.780

100+ parts

$0.710

1k+ parts

$0.680

10k+ parts

$0.680

93,136

$0.780

$0.710

$0.680

$0.680

Andel Nordic

Denmark . 1,780 parts In-Stock

1+ parts

$3.222

100+ parts

-

1k+ parts

$3.094

10k+ parts

$3.094

1,780

$3.222

-

$3.094

$3.094

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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West Coast Incorporated

USA . 3,860 parts In-Stock

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3,860

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Lixinc

USA . 1,967 parts In-Stock

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1,967

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Kepictronics

USA . 400 parts In-Stock

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400

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Netroflash

USA . 50 parts In-Stock

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50

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Perfect Parts

USA . 50 parts In-Stock

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50

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Overview

Enhance your electronic projects with the PL133-27GC-R clock driver and buffer from industry-leader Microchip Technology. This high-quality component provides reliable input conditioning and precise output timing, making it ideal for a wide range of applications. With its small outline and very thin profile design, this product is perfect for compact devices where space is limited. Trust in Microchip's reputation for excellence and innovation, and experience the value and benefits that the PL133-27GC-R brings to your projects. Upgrade your designs today with this top-of-the-line clock driver and buffer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the clock driver, ensuring reliable performance over time.

Surface Mount: YES

Allows for easy installation on a circuit board, saving space and simplifying the manufacturing process.

Nominal Supply Voltage / Vsup (V): 1.8

Operates at a standard voltage level, making it compatible with a wide range of electronic systems.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures, making it suitable for various environmental conditions.

Minimum Operating Temperature: 0 °C

Can function even in low temperature environments, providing reliability in different operating conditions.

Width: 1.3 mm

Compact size allows for installation in space-constrained devices or circuits.

Temperature Grade: COMMERCIAL

Meets industry standards for commercial applications, ensuring compatibility with a wide range of electronic devices and systems.

Maximum Supply Voltage (Vsup): 3.63 V

Capable of handling higher voltage levels, offering flexibility in different power supply configurations.

Technical Specifications

Clock Drivers & Buffers PL133-27GC-R attributes and parameters. Explore more Clock Drivers & Buffers devices from Microchip Technology

Specs

Family:

PL133

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-N6

Length:

2 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

6

No. of True Outputs:

2

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Same Edge Skew (tskwd):

.5 ns

Maximum Seated Height:

.6 mm

Maximum Supply Voltage (Vsup):

3.63 V

Minimum Supply Voltage (Vsup):

1.62 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.3 mm

Trade Compliance

PL133-27GC-R Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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