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PIC32MZ2064DAR169T-I/6J

Microchip Technology

PIC32MZ2064DAR169T-I/6J by Microchip Technology

PIC32MZ2064DAR169T-I/6J by Microchip Technology is a 32-bit microcontroller with 64 MHz clock frequency, 120 I/O lines, and 45-Ch 12-Bit ADC channels. Ideal for industrial applications requiring low power mode, it features integrated cache, DMA channels, and peripherals like timers and UART for efficient data processing.

Median Price

$28.582

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

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$28.582

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50

$28.582

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Vyrian

USA . 4,792 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 284 parts In-Stock

1+ parts

$9.474

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284

$9.474

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Ampacity Inc.

Singapore . 1,087 parts In-Stock

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$22.000

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$22.000

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Continental Prestige Electronics

USA . 4,029 parts In-Stock

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$28.582

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$28.011

4,029

$28.582

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$28.011

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$33.079

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$30.102

1k+ parts

$27.125

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500

$33.079

$30.102

$27.125

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Corohmni

South Africa . 221 parts In-Stock

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$61.664

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Aztec Data Supply Inc.

USA . 171 parts In-Stock

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$62.999

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171

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Argo Parts USA

USA . 3,637 parts In-Stock

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Fulton Briggs Corp.

USA . 1,024 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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$28.011

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$27.153

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$26.582

100

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$28.011

$27.153

$26.582

Overview

Experience the cutting-edge technology of Microchip Technology with the PIC32MZ2064DAR169T-I/6J microcontroller. This powerful device offers exceptional performance and reliability for a wide range of applications. With integrated cache, multiple peripherals, and low power mode, this microcontroller provides unparalleled value and benefits to customers looking to optimize their designs. Trust in the quality and innovation of Microchip Technology to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the microcontroller, making it suitable for various applications.

Integrated Cache: YES

Improves performance by storing frequently accessed data for quick retrieval.

Maximum Supply Voltage: 1.9 V

Allows for flexible power options and compatibility with various power sources.

On Chip Data RAM Width: 8

Provides ample space for temporary data storage to support processing tasks efficiently.

ADC Channels: YES

Enables analog to digital conversion, essential for interfacing with sensors and other analog devices.

DMA Channels: YES

Facilitates Direct Memory Access for efficient data transfer and processing, reducing CPU load.

ROM Programmability: FLASH

Offers flexibility for rewriting and updating the program memory multiple times.

Peripherals: BOR, COMPARATOR(2), POR, RTCC, TIMER(11), WDT

Includes a variety of peripherals for enhanced functionality and connectivity options.

Maximum Clock Frequency: 64 MHz

Delivers high processing speed, suitable for applications requiring real-time data processing.

Analog To Digital Convertors: 45-Ch 12-Bit

Allows for high-resolution analog to digital conversion, crucial for accurate sensor readings.

Technical Specifications

Microcontrollers PIC32MZ2064DAR169T-I/6J attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

64 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B169

Length:

11 mm

Low Power Mode:

YES

No. of DMA Channels:

8

No. of External Interrupts:

5

No. of I/O Lines:

120

No. of Terminals:

169

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

RAM Bytes:

655360

RAM Words:

655360

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1.56 mm

Speed:

200 rpm

Maximum Supply Current:

172 mA

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

11 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(5), I2S(6), SPI(6), UART(6)

Peripherals:

BOR, COMPARATOR(2), POR, RTCC, TIMER(11), WDT

Analog To Digital Convertors:

45-Ch 12-Bit

Trade Compliance

PIC32MZ2064DAR169T-I/6J Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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