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PIC32MZ2048EFH144T-I/PL

Microchip Technology

PIC32MZ2048EFH144T-I/PL by Microchip Technology

PIC32MZ2048EFH144T-I/PL by Microchip: 32-bit RISC CPU, 64 MHz clock, 48-Ch ADC for industrial applications. Features 16 DMA channels, 9 timers, and CAN/Ethernet connectivity. Low power mode with 130 mA max supply current ideal for IoT devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,315 parts In-Stock

1+ parts

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6,315

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Nova Conductors

Japan . 750 parts In-Stock

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750

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 943 parts In-Stock

1+ parts

$9.900

100+ parts

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943

$9.900

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Ampacity Inc.

Singapore . 226 parts In-Stock

1+ parts

$23.000

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226

$23.000

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Corohmni

South Africa . 532 parts In-Stock

1+ parts

$53.442

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532

$53.442

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Component Stockers USA

USA . 501 parts In-Stock

1+ parts

$242.780

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501

$242.780

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RGB Technical Solutions

Ukraine . 4,293 parts In-Stock

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4,293

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Netroflash

USA . 50 parts In-Stock

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50

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Overview

Unleash the power of cutting-edge technology with the PIC32MZ2048EFH144T-I/PL by Microchip Technology. As a leader in microcontrollers, Microchip delivers unmatched quality and reliability, making this product a game-changer in various applications. This high-performance microcontroller offers unparalleled value with its integrated cache, low power mode, and extensive connectivity options. Experience seamless operation and enhanced functionality with the PIC32MZ2048EFH144T-I/PL, designed to elevate your projects to new heights. Elevate your projects with Microchip Technology's PIC32MZ2048EFH144T-I/PL.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications while also providing protection for the internal components.

Integrated Cache: YES

The integrated cache helps improve processing speed and efficiency, allowing for quicker access to frequently used data and instructions.

Maximum Supply Voltage: 3.6 V

With a higher maximum supply voltage, the product can handle power fluctuations and variations without risking damage to the internal components.

On Chip Data RAM Width: 8

A wider data RAM width allows for faster data transfer and processing, enhancing overall performance and responsiveness of the product.

Package Shape: SQUARE

The square package shape offers efficient use of space and easy integration into various electronic devices or systems.

Maximum Clock Frequency: 64 MHz

With a high clock frequency, the product can handle complex tasks and processes quickly, making it suitable for demanding applications.

ROM Programmability: FLASH

Flash programmability allows for easy and efficient updates to the product's firmware or software, ensuring flexibility and adaptability over time.

Analog To Digital Convertors: 48-Ch 12-Bit

The multiple analog to digital converters with high resolution provide accurate and precise data conversion, making the product suitable for applications requiring reliable sensor data.

Connectivity: CAN(2), ETHERNET, I2C(5), I2S(6), IRDA, LIN, SMBUS, SPI(6), SQI, UART(6), USB

The wide range of connectivity options allows for seamless integration with various devices and systems, enhancing the product's versatility and compatibility.

Low Power Mode: YES

The availability of low power mode helps in reducing power consumption and extending battery life, making the product energy-efficient and suitable for portable devices.

Technical Specifications

Microcontrollers PIC32MZ2048EFH144T-I/PL attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

IT ALSO HAS 12-CH DEDICATED DMA AND 160KBYTE OF BOOT FLASH MEMORY

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

64 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of External Interrupts:

5

No. of I/O Lines:

120

No. of Terminals:

144

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

524288

RAM Words:

524288

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1.6 mm

Speed:

200 rpm

Maximum Supply Current:

130 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.1 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), ETHERNET, I2C(5), I2S(6), IRDA, LIN, SMBUS, SPI(6), SQI, UART(6), USB

Peripherals:

BOD, COMPARATOR(2), DMA(16), DMT, POR, PWM(9), RTCC, TIMER(9), WDT

Analog To Digital Convertors:

48-Ch 12-Bit

Trade Compliance

PIC32MZ2048EFH144T-I/PL Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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