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PIC32MZ2048EFG064T-I/MR

Microchip Technology

PIC32MZ2048EFG064T-I/MR by Microchip Technology

PIC32MZ2048EFG064T-I/MR by Microchip Technology is a 32-bit microcontroller with 64 MHz clock frequency, 24-Ch 12-Bit ADC, and 16 DMA channels. It is used in industrial applications requiring low power mode, featuring CAN, Ethernet, I2C, SPI connectivity options. The chip has a package style of CHIP CARRIER and operates b/w -40 to 85 °C temperature range.

Median Price

$17.712

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

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$17.712

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$17.712

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Vyrian

USA . 6,428 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 554 parts In-Stock

1+ parts

$8.000

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554

$8.000

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AZTECH Wire

Italy . 617 parts In-Stock

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$13.218

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617

$13.218

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Continental Prestige Electronics

USA . 1,255 parts In-Stock

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$17.712

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$17.358

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$17.358

Netroflash

USA . 50 parts In-Stock

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$17.712

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50

$17.712

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Semicontronic

India . 621 parts In-Stock

1+ parts

$23.000

100+ parts

$22.425

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$22.310

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621

$23.000

$22.425

$22.310

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Aztec Data Supply Inc.

USA . 300 parts In-Stock

1+ parts

$39.270

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300

$39.270

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Corohmni

South Africa . 182 parts In-Stock

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$84.132

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LMD Electronica

Estonia . 5,039 parts In-Stock

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LOOK Integrated Logistics

Peru . 4,019 parts In-Stock

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Montano Global Distributors

Canada . 2,173 parts In-Stock

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NIA Electronics

USA . 1,901 parts In-Stock

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Ledger Components

France . 1,901 parts In-Stock

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Argo Parts USA

USA . 1,828 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Overview

Unlock a world of possibilities with the Microchip Technology PIC32MZ2048EFG064T-I/MR microcontroller, delivering top-quality performance and reliability in a compact package. From industrial automation to consumer electronics, this versatile device is designed to meet the demands of a wide range of applications. With advanced features like integrated cache and multiple connectivity options, customers can expect seamless operation and enhanced efficiency. Trust in Microchip Technology's proven track record of excellence and innovation, and discover the value and benefits that the PIC32MZ2048EFG064T-I/MR brings to your projects.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

This material provides good protection for the microcontroller chip and ensures reliable performance.

Integrated Cache - YES

The presence of integrated cache improves performance by reducing access time to frequently used data.

Maximum Supply Voltage - 3.6 V

Allows for flexibility in power supply options and compatibility with a variety of systems.

Surface Mount - YES

Enables easy integration onto printed circuit boards, saving space and reducing assembly time.

Package Style - CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers efficient heat dissipation and compact size, ideal for space-constrained applications.

Technical Specifications

Microcontrollers PIC32MZ2048EFG064T-I/MR attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

IT ALSO HAS 12-CH DEDICATED DMA AND 160KBYTE OF BOOT FLASH MEMORY

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

64 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

No. of DMA Channels:

16

No. of External Interrupts:

5

No. of I/O Lines:

46

No. of Terminals:

64

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Bytes:

524288

RAM Words:

524288

ROM Words:

2097152

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

.9 mm

Speed:

200 rpm

Maximum Supply Current:

130 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.1 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), ETHERNET, I2C(5), I2S(6), IRDA, LIN, SMBUS, SPI(6), SQI, UART(6), USB

Peripherals:

BOD, COMPARATOR(2), DMA(16), DMT, POR, PWM(9), RTCC, TIMER(9), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

PIC32MZ2048EFG064T-I/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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