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PIC32MZ1024EFH100-E/GJX

Microchip Technology

PIC32MZ1024EFH100-E/GJX by Microchip Technology

PIC32MZ1024EFH100-E/GJX by Microchip Technology is a 32-bit microcontroller with 64 MHz clock frequency, 40-Ch 12-Bit ADCs, and 12 DMA channels. Ideal for automotive applications due to AEC-Q100 screening level and wide temperature range (-40 to 125 °C). Features include CAN, Ethernet, USB connectivity, and low power mode for efficient performance.

Median Price

$11.957

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$11.957

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15

$11.957

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Vyrian

USA . 2,962 parts In-Stock

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2,962

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 1,105 parts In-Stock

1+ parts

$11.957

100+ parts

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$11.718

1,105

$11.957

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$11.718

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$11.957

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$11.957

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Corohmni

South Africa . 49 parts In-Stock

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$15.713

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49

$15.713

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AZTECH Wire

Italy . 611 parts In-Stock

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$18.780

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611

$18.780

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Ampacity Inc.

Singapore . 1,008 parts In-Stock

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$22.000

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1,008

$22.000

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Aztec Data Supply Inc.

USA . 672 parts In-Stock

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$77.433

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672

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RGB Technical Solutions

Ukraine . 7,909 parts In-Stock

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Argo Parts USA

USA . 1,950 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Overview

Experience the next level of performance and reliability with the Microchip Technology PIC32MZ1024EFH100-E/GJX microcontroller. As a leading manufacturer in the industry, Microchip Technology ensures top-notch quality and cutting-edge technology in their products. This microcontroller offers a wide range of applications in automotive and industrial settings, providing customers with unparalleled value and benefits. With integrated cache, advanced peripherals, and low power modes, this product delivers exceptional speed, efficiency, and versatility to meet all your needs. Upgrade to the PIC32MZ1024EFH100-E/GJX and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller ideal for portable or rugged applications.

Integrated Cache: YES

Having an integrated cache helps in improving the overall performance of the microcontroller by reducing the access time to frequently used data.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power supply design and compatibility with a wide range of applications.

On Chip Data RAM Width: 8

With a wider data RAM width, the microcontroller can process larger chunks of data at a time, increasing efficiency.

Screening Level: AEC-Q100; TS 16949

These screening levels ensure high reliability and quality standards, making the microcontroller suitable for automotive and industrial applications where reliability is crucial.

Maximum Clock Frequency: 64 MHz

The high maximum clock frequency allows for fast processing speed, making the microcontroller suitable for applications that require real-time processing.

Technical Specifications

Microcontrollers PIC32MZ1024EFH100-E/GJX attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

IT ALSO HAS 12-CH DEDICATED DMA AND 160KBYTE OF BOOT FLASH MEMORY

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

64 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of External Interrupts:

5

No. of I/O Lines:

78

No. of Terminals:

100

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Bytes:

524288

RAM Words:

524288

ROM Words:

1048576

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.06 mm

Speed:

180 rpm

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.1 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), ETHERNET, I2C(5), I2S(6), IRDA, LIN, PMP, SPI(6), UART(6), USB

Peripherals:

BOD, COMPARATOR(2), DMA(12), POR, PWM(9), RTCC, TIMER(9), WDT

Analog To Digital Convertors:

40-Ch 12-Bit

Trade Compliance

PIC32MZ1024EFH100-E/GJX Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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