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PIC32MZ1024EFE100T-I/GJX

Microchip Technology

PIC32MZ1024EFE100T-I/GJX by Microchip Technology

PIC32MZ1024EFE100T-I/GJX by Microchip Technology is a 32-bit microcontroller with 1048576 ROM words and 262144 RAM words. It features 40-Ch 12-Bit ADC channels, 12 DMA channels, and operates at a max clock frequency of 64 MHz. Ideal for industrial applications requiring high-speed processing and connectivity via CAN, Ethernet, I2C, I2S, LIN, SPI, UART, and USB interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,402 parts In-Stock

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2,402

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

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AZTECH Wire

Italy . 847 parts In-Stock

1+ parts

$9.836

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847

$9.836

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Ampacity Inc.

Singapore . 1,342 parts In-Stock

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$12.000

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1,342

$12.000

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Aztec Data Supply Inc.

USA . 3,456 parts In-Stock

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$19.453

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3,456

$19.453

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Corohmni

South Africa . 65 parts In-Stock

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$33.534

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65

$33.534

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QUARKTWIN TECHNOLOGY LTD

USA . 19,854 parts In-Stock

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19,854

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West Coast Incorporated

USA . 5,127 parts In-Stock

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5,127

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Continental Prestige Electronics

USA . 4,839 parts In-Stock

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4,839

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Argo Parts USA

USA . 1,632 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Overview

Unleash the power of innovation with the PIC32MZ1024EFE100T-I/GJX by Microchip Technology. As a leader in microcontrollers, Microchip ensures top-quality products that set the standard for excellence. This versatile microcontroller is perfect for a wide range of applications, offering unmatched performance and reliability. Experience seamless connectivity, high-speed processing, and low power consumption, all packed into a compact and durable package. Elevate your projects with the PIC32MZ1024EFE100T-I/GJX and unlock limitless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, making it suitable for various environments.

Integrated Cache: YES

Improves processing speed by storing frequently accessed data, enhancing overall performance.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of power supply options, offering flexibility in system design.

Bit Size: 32

Enables efficient handling of large data sets and complex calculations.

Maximum Clock Frequency: 64 MHz

Ensures high-speed operation and responsiveness for demanding applications.

Connectivity: CAN(2), ETHERNET, I2C(5), I2S(6), IRDA, LIN, PMP, SPI(6), UART(6), USB

Provides versatile connectivity options for interfacing with a wide range of devices and peripherals.

Speed: 252 rpm

Supports rapid data processing and execution, optimizing performance in real-time applications.

Low Power Mode: YES

Helps conserve energy and extend battery life, making the microcontroller suitable for power-sensitive applications.

Technical Specifications

Microcontrollers PIC32MZ1024EFE100T-I/GJX attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

IT ALSO HAS 12-CH DEDICATED DMA AND 160KBYTE OF BOOT FLASH MEMORY

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

64 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e1

Length:

7 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of External Interrupts:

5

No. of I/O Lines:

78

No. of Terminals:

100

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

RAM Bytes:

262144

RAM Words:

262144

ROM Words:

1048576

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1.06 mm

Speed:

252 rpm

Maximum Supply Current:

135 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.1 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), ETHERNET, I2C(5), I2S(6), IRDA, LIN, PMP, SPI(6), UART(6), USB

Peripherals:

BOD, COMPARATOR(2), DMA(12), POR, PWM(9), RTCC, TIMER(9), WDT

Analog To Digital Convertors:

40-Ch 12-Bit

Trade Compliance

PIC32MZ1024EFE100T-I/GJX Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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