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PIC32MZ0512EFE144-E/PL

Microchip Technology

PIC32MZ0512EFE144-E/PL by Microchip Technology

PIC32MZ0512EFE144-E/PL by Microchip: 32-bit RISC CPU, 64 MHz clock, 48-Ch ADC. Ideal for automotive applications with AEC-Q100 screening, low power mode, and extensive connectivity options like Ethernet and USB.

Median Price

$12.570

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 91 parts In-Stock

1+ parts

$12.570

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91

$12.570

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Vyrian

USA . 3,748 parts In-Stock

1+ parts

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3,748

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 563 parts In-Stock

1+ parts

$11.725

100+ parts

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563

$11.725

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Ampacity Inc.

Singapore . 1,401 parts In-Stock

1+ parts

$17.000

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1,401

$17.000

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RGB Technical Solutions

Ukraine . 5,682 parts In-Stock

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5,682

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Netroflash

USA . 500 parts In-Stock

1+ parts

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$12.319

1k+ parts

$11.941

10k+ parts

$11.690

500

-

$12.319

$11.941

$11.690

Overview

Unleash the power of cutting-edge technology with the Microchip Technology PIC32MZ0512EFE144-E/PL microcontroller. With a wealth of features such as integrated cache, advanced peripherals, and low power modes, this device is ideal for a wide range of applications. Trust in the renowned quality of Microchip Technology to deliver reliable performance and innovative solutions. Elevate your projects with the PIC32MZ0512EFE144-E/PL and experience unparalleled value, efficiency, and versatility in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and resistance to external factors, making the product suitable for a wide range of applications.

Integrated Cache: YES

The presence of integrated cache helps in improving the performance and efficiency of the microcontroller by reducing access times to frequently used data.

Maximum Supply Voltage: 3.6 V

The higher maximum supply voltage allows for flexibility in power supply options and compatibility with various voltage levels in different systems.

On Chip Data RAM Width: 8

The wide data RAM width enables efficient data processing and storage capabilities within the microcontroller.

Screening Level: AEC-Q100; TS 16949

Adhering to these screening levels ensures high quality and reliability of the product, making it suitable for automotive and industrial applications with stringent requirements.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and easy integration into compact designs.

Bit Size: 32

The 32-bit architecture of the microcontroller offers enhanced processing power and capability for handling complex tasks efficiently.

No. of Terminals: 144

With a high number of terminals, the microcontroller provides extensive connectivity options for interfacing with various external devices and components.

Minimum Supply Voltage: 2.1 V

The lower minimum supply voltage allows for operation in lower power scenarios, contributing to energy efficiency and extended battery life.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range ensures reliable performance in harsh environmental conditions, making it suitable for automotive and industrial applications.

Technical Specifications

Microcontrollers PIC32MZ0512EFE144-E/PL attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

IT ALSO HAS 12-CH DEDICATED DMA AND 160KBYTE OF BOOT FLASH MEMORY

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

64 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Low Power Mode:

YES

No. of DMA Channels:

12

No. of External Interrupts:

5

No. of I/O Lines:

120

No. of Terminals:

144

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Bytes:

131072

RAM Words:

131072

ROM Words:

524288

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.6 mm

Speed:

180 rpm

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.1 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ETHERNET, I2C(5), I2S(6), IRDA, LIN, PMP, SPI(6), UART(6), USB

Peripherals:

BOD, COMPARATOR(2), DMA(12), POR, PWM(9), RTCC, TIMER(9), WDT

Analog To Digital Convertors:

48-Ch 12-Bit

Trade Compliance

PIC32MZ0512EFE144-E/PL Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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