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PIC32MX570F512LT-50I/PT

Microchip Technology

PIC32MX570F512LT-50I/PT by Microchip Technology

PIC32MX570F512LT-50I/PT by Microchip: 32-bit RISC CPU, 524288 ROM words, 65536 RAM words. Ideal for industrial applications requiring high-speed processing and connectivity with peripherals like CAN, USB, and UART. Operates at up to 50 MHz clock frequency in a compact package with low power mode.

Median Price

$9.310

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$9.310

100+ parts

-

1k+ parts

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10k+ parts

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1,000

$9.310

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Vyrian

USA . 4,369 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,369

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 558 parts In-Stock

1+ parts

$5.209

100+ parts

-

1k+ parts

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10k+ parts

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558

$5.209

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Continental Prestige Electronics

USA . 1,204 parts In-Stock

1+ parts

$9.310

100+ parts

-

1k+ parts

-

10k+ parts

$9.124

1,204

$9.310

-

-

$9.124

Ampacity Inc.

Singapore . 723 parts In-Stock

1+ parts

$28.000

100+ parts

-

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723

$28.000

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RGB Technical Solutions

Ukraine . 7,554 parts In-Stock

1+ parts

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7,554

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Argo Parts USA

USA . 4,119 parts In-Stock

1+ parts

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4,119

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Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$9.124

1k+ parts

$8.845

10k+ parts

$8.658

50

-

$9.124

$8.845

$8.658

Overview

Discover the power and precision of the PIC32MX570F512LT-50I/PT by Microchip Technology. Designed with cutting-edge technology and top-quality materials, this microcontroller offers a wide range of applications in various industries. With its high performance and reliable features, customers can experience seamless operation and enhanced functionality. Unlock new possibilities and elevate your projects with the exceptional value and benefits that this product provides. Elevate your creations with Microchip Technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, ideal for portable and rugged applications.

Maximum Supply Voltage: 3.6 V

High supply voltage allows for versatility in power supply options and compatibility with a wide range of electronic components.

No. of External Interrupts: 5

Multiple external interrupts enable the microcontroller to respond quickly to events from external sources, enhancing real-time performance.

RAM Words: 65536

Large RAM capacity allows for efficient data storage and processing, essential for complex applications and multitasking.

Maximum Clock Frequency: 50 MHz

High clock frequency enables fast data processing and execution, making the microcontroller suitable for high-speed applications.

Connectivity: CAN, I2C(2), I2S(4), IRDA, LIN, SPI(4), UART(5), USB

Versatile connectivity options provide easy integration with various communication protocols and peripherals, expanding the capabilities of the microcontroller.

ROM Programmability: FLASH

Flash programmability allows for easy and efficient updates to the firmware, improving flexibility and future-proofing the product.

Technical Specifications

Microcontrollers PIC32MX570F512LT-50I/PT attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

12 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of I/O Lines:

81

No. of Terminals:

100

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

RAM Bytes:

65536

RAM Words:

65536

ROM Words:

524288

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Speed:

50 rpm

Maximum Supply Current:

32 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), I2S(4), IRDA, LIN, SPI(4), UART(5), USB

Peripherals:

BOR, COMPARATOR(3), DMA(4), POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

48-Ch 10-Bit

Trade Compliance

PIC32MX570F512LT-50I/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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