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PIC32MX570F512HT-I/MR

Microchip Technology

PIC32MX570F512HT-I/MR by Microchip Technology

PIC32MX570F512HT-I/MR by Microchip offers 32-bit CPU, 16384 RAM words, and 131072 ROM words. Ideal for industrial applications, it features 28-Ch ADCs, 7 timers, and connectivity options like I2C(2), SPI(3), UART(4). With a max clock frequency of 40 MHz and low power mode support, it's suitable for various microcontroller projects.

Median Price

$5.170

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$5.170

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50

$5.170

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Vyrian

USA . 3,991 parts In-Stock

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3,991

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Distributors (Availability)

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Continental Prestige Electronics

USA . 4,007 parts In-Stock

1+ parts

$5.170

100+ parts

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$5.067

4,007

$5.170

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$5.067

AZTECH Wire

Italy . 544 parts In-Stock

1+ parts

$12.371

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544

$12.371

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Ampacity Inc.

Singapore . 505 parts In-Stock

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$14.000

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505

$14.000

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Corohmni

South Africa . 648 parts In-Stock

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$40.446

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648

$40.446

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Aztec Data Supply Inc.

USA . 1,984 parts In-Stock

1+ parts

$45.935

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1,984

$45.935

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LOOK Integrated Logistics

Peru . 8,188 parts In-Stock

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8,188

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Montano Global Distributors

Canada . 7,847 parts In-Stock

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NIA Electronics

USA . 4,709 parts In-Stock

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Ledger Components

France . 4,709 parts In-Stock

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LMD Electronica

Estonia . 2,230 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$5.067

1k+ parts

$4.912

10k+ parts

$4.808

2,000

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$5.067

$4.912

$4.808

Argo Parts USA

USA . 1,914 parts In-Stock

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Overview

Unlock the potential of your next project with the PIC32MX570F512HT-I/MR by Microchip Technology. This powerful microcontroller offers unmatched quality and reliability, backed by a reputable manufacturer known for cutting-edge technology. Ideal for a wide range of applications, this product provides customers with value, benefits, and advantages that will take their projects to the next level. Say goodbye to limitations and hello to endless possibilities with the PIC32MX570F512HT-I/MR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring longevity of the product.

Maximum Supply Voltage: 3.6 V

Allows for a wide range of power options, making the microcontroller versatile and compatible with various circuits.

CPU Family: PIC32

Belonging to the PIC32 family signifies a high-quality and well-established microcontroller brand, ensuring reliability in performance.

Maximum Clock Frequency: 40 MHz

High clock frequency allows for faster processing speeds and efficient operation of the microcontroller.

Analog To Digital Convertors: 28-Ch 10-Bit

Having 28 analog to digital converters with 10-bit resolution provides precise and accurate conversion of analog signals, making it suitable for a wide range of applications.

Connectivity: I2C(2), SPI(3), UART(4)

Multiple connectivity options such as I2C, SPI, and UART enable easy communication with external devices and peripherals, enhancing the microcontroller's functionality.

ROM Programmability: FLASH

Flash programmability allows for easy and flexible firmware updates, ensuring the microcontroller can be adapted to changing requirements or improvements.

Low Power Mode: YES

The ability to operate in a low power mode conserves energy and extends battery life, making it ideal for applications requiring power efficiency.

Technical Specifications

Microcontrollers PIC32MX570F512HT-I/MR attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Additional Features:

3KB BOOT FLASH AVAILABLE

Address Bus Width:

16

Bit Size:

32

CPU Family:

PIC32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of I/O Lines:

49

No. of Terminals:

64

No. of Timers:

7

On Chip Data RAM Width:

32

On Chip Program ROM Width:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

RAM Bytes:

65536

RAM Words:

16384

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

50 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Connectivity:

I2C(2), SPI(3), UART(4)

Peripherals:

ANALOG COMPARATOR(3), DMA(4), POR, PWM, TIMER(5), WDT

Analog To Digital Convertors:

28-Ch 10-Bit

Trade Compliance

PIC32MX570F512HT-I/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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