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PIC32MX550F256H-V/PT

Microchip Technology

PIC32MX550F256H-V/PT by Microchip Technology

PIC32MX550F256H-V/PT by Microchip Technology is a 32-bit microcontroller with 262144 ROM words and 32768 RAM words. It operates at a max frequency of 40 MHz, suitable for industrial applications requiring low power consumption. With various peripherals like BOR, PWM, and USB connectivity, it offers versatile solutions in embedded systems design.

Median Price

$5.405

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 51 parts In-Stock

1+ parts

$5.405

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51

$5.405

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Vyrian

USA . 7,519 parts In-Stock

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7,519

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,496 parts In-Stock

1+ parts

$1.000

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1,496

$1.000

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AZTECH Wire

Italy . 218 parts In-Stock

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$5.308

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218

$5.308

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Continental Prestige Electronics

USA . 446 parts In-Stock

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$5.405

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$5.297

446

$5.405

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$5.297

Netroflash

USA . 50 parts In-Stock

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$5.405

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50

$5.405

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Aztec Data Supply Inc.

USA . 3,858 parts In-Stock

1+ parts

$30.710

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3,858

$30.710

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Corohmni

South Africa . 313 parts In-Stock

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$36.809

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313

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NIA Electronics

USA . 6,841 parts In-Stock

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Ledger Components

France . 6,841 parts In-Stock

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LMD Electronica

Estonia . 5,517 parts In-Stock

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5,517

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Montano Global Distributors

Canada . 4,170 parts In-Stock

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Argo Parts USA

USA . 3,431 parts In-Stock

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LOOK Integrated Logistics

Peru . 3,300 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the Microchip Technology PIC32MX550F256H-V/PT microcontroller. Designed for industrial-grade performance, this versatile device offers a wide range of connectivity options and peripherals, making it ideal for a variety of applications. With its high-quality construction and reliable operation, you can trust Microchip Technology to deliver top-notch products every time. Take your projects to the next level with the PIC32MX550F256H-V/PT and experience the value and benefits that only Microchip Technology can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to harsh environments, making the product suitable for various applications.

Maximum Supply Voltage: 3.6 V

Allows for flexibility and compatibility with a wide range of power sources.

On Chip Data RAM Width: 8

Enables efficient data processing and storage within the microcontroller.

Surface Mount: YES

Facilitates easy assembly and integration onto circuit boards.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture for high performance and efficient operation of peripheral functions.

ADC Channels: YES

Incorporates Analog to Digital Converters for precise measurement and data acquisition.

Maximum Clock Frequency: 40 MHz

Offers high speed operation for quick and responsive performance.

Connectivity: CAN, I2C(2), I2S(3), IRDA, LIN, SPI(3), UART(4), USB

Supports a variety of communication protocols for versatile connectivity options.

Technical Specifications

Microcontrollers PIC32MX550F256H-V/PT attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of I/O Lines:

49

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.2 mm

Speed:

40 rpm

Maximum Supply Current:

32 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), I2S(3), IRDA, LIN, SPI(3), UART(4), USB

Peripherals:

BOR, COMPARATOR(3), DMA(4), POR, PWM, RTC, TIMER(5), WDT

Analog To Digital Convertors:

28-Ch 10-Bit

Trade Compliance

PIC32MX550F256H-V/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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