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PIC32MX470F512L-V/PT

Microchip Technology

PIC32MX470F512L-V/PT by Microchip Technology

PIC32MX470F512L-V/PT by Microchip: 32-bit RISC CPU, 50 MHz clock, 131072 RAM bytes. Ideal for industrial applications requiring high-speed processing and extensive connectivity options like USB, RS232, SPI. Features low power mode and 28-Ch 10-Bit ADC for efficient power management and precise analog-to-digital conversion.

Median Price

$9.180

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$9.180

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15

$9.180

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Vyrian

USA . 3,577 parts In-Stock

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3,577

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 878 parts In-Stock

1+ parts

$5.687

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-

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878

$5.687

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Continental Prestige Electronics

USA . 129 parts In-Stock

1+ parts

$9.180

100+ parts

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$8.996

129

$9.180

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$8.996

Netroflash

USA . 50 parts In-Stock

1+ parts

$9.180

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50

$9.180

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Ampacity Inc.

Singapore . 133 parts In-Stock

1+ parts

$35.000

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133

$35.000

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RGB Technical Solutions

Ukraine . 6,233 parts In-Stock

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6,233

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Argo Parts USA

USA . 2,026 parts In-Stock

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2,026

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Overview

Unlock endless possibilities with the PIC32MX470F512L-V/PT microcontroller by Microchip Technology. This innovative device offers unparalleled quality and reliability, making it the perfect choice for a wide range of applications. With advanced features and cutting-edge technology, this microcontroller provides customers with unmatched value and benefits. Experience seamless performance and efficiency with the PIC32MX470F512L-V/PT, the ultimate solution for all your electronic design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Maximum Supply Voltage: 2.3 V

Operates efficiently with a low maximum supply voltage, making it suitable for low power applications.

No. of Terminals: 100

Provides ample connectivity options for various external components and peripherals.

ROM Words: 524288

Large ROM capacity allows for storing a significant amount of program data.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances the processing speed and efficiency of the microcontroller.

No. of Timers: 5

Multiple timer options enable precise timing control for different operations.

Analog To Digital Convertors: 28-Ch 10-Bit

High number of ADC channels with 10-bit resolution for accurate analog to digital conversions.

Connectivity: I2C(2), I2S(2), IRDA, LIN, RS232, RS485, SMBUS, SPI(2), UART(5), USB

Supports a wide range of communication protocols, enabling seamless integration with various devices.

Speed: 80 rpm

Operating at a speed of 80 rpm allows for fast processing and response times.

No. of I/O Lines: 81

Ample I/O lines for interfacing with external devices and sensors, increasing the versatility of the microcontroller.

Technical Specifications

Microcontrollers PIC32MX470F512L-V/PT attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of I/O Lines:

81

No. of Terminals:

100

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

TQFP100,.55SQ,16

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

131072

RAM Words:

131072

ROM Words:

524288

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.2 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

2.3 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S(2), IRDA, LIN, RS232, RS485, SMBUS, SPI(2), UART(5), USB

Peripherals:

BOR, COMPARATOR(2), DMA(4), POR, PWM(5), RTC, TIMER(5), WDT

Analog To Digital Convertors:

28-Ch 10-Bit

Trade Compliance

PIC32MX470F512L-V/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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