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PIC32MX470F512H-V/MR

Microchip Technology

PIC32MX470F512H-V/MR by Microchip Technology

PIC32MX470F512H-V/MR by Microchip Technology is a 32-bit microcontroller with 131072 RAM words and 524288 ROM words. It operates at a max clock frequency of 50 MHz, suitable for industrial applications requiring low power mode and connectivity via I2C, SPI, UART, USB interfaces.

Median Price

$8.110

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$8.110

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870

$8.110

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Vyrian

USA . 8,732 parts In-Stock

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8,732

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,535 parts In-Stock

1+ parts

$7.000

100+ parts

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1,535

$7.000

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Netroflash

USA . 500 parts In-Stock

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$8.110

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500

$8.110

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Continental Prestige Electronics

USA . 220 parts In-Stock

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$8.110

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$7.948

220

$8.110

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$7.948

AZTECH Wire

Italy . 773 parts In-Stock

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$19.629

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773

$19.629

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Corohmni

South Africa . 354 parts In-Stock

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$30.321

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354

$30.321

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Aztec Data Supply Inc.

USA . 3,793 parts In-Stock

1+ parts

$55.370

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3,793

$55.370

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LMD Electronica

Estonia . 6,560 parts In-Stock

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6,560

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Montano Global Distributors

Canada . 6,321 parts In-Stock

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Argo Parts USA

USA . 2,658 parts In-Stock

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2,658

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NIA Electronics

USA . 1,349 parts In-Stock

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1,349

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Ledger Components

France . 1,349 parts In-Stock

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1,349

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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LOOK Integrated Logistics

Peru . 111 parts In-Stock

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111

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Overview

Experience the power of cutting-edge technology with Microchip Technology's PIC32MX470F512H-V/MR microcontroller. Designed to meet the highest quality standards, this versatile component offers a wide range of applications in various industries. With its advanced features and reliable performance, customers can benefit from increased efficiency, improved functionality, and seamless integration. Trust Microchip Technology to deliver innovation and excellence in every product, providing value and advantages that set you apart from the competition. Elevate your projects with the PIC32MX470F512H-V/MR and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material allows for a lightweight and durable package, making the product ideal for portable applications.

Maximum Supply Voltage: 2.3 V

Low maximum supply voltage helps in reducing power consumption and heat generation, increasing overall energy efficiency of the product.

Bit Size: 32

Larger bit size allows for processing more data at once, enhancing the overall performance of the microcontroller.

Temperature Grade: INDUSTRIAL

Industrial grade temperature range ensures reliable operation in harsh environmental conditions, making the product suitable for industrial applications.

Connectivity: I2C(2), I2S(2), IRDA, LIN, RS232, RS485, SMBUS, SPI(2), UART(4), USB

Wide range of connectivity options enable seamless integration with various devices and systems, expanding the product's compatibility and versatility.

Technical Specifications

Microcontrollers PIC32MX470F512H-V/MR attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of I/O Lines:

49

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

131072

RAM Words:

131072

ROM Words:

524288

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

2.3 V

Minimum Supply Voltage:

3.3 V

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S(2), IRDA, LIN, RS232, RS485, SMBUS, SPI(2), UART(4), USB

Peripherals:

BOR, COMPARATOR(2), DMA(4), POR, PWM(5), RTC, TIMER(5), WDT

Analog To Digital Convertors:

28-Ch 10-Bit

Trade Compliance

PIC32MX470F512H-V/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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