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PIC32MX440F128L-80V/BG

Microchip Technology

PIC32MX440F128L-80V/BG by Microchip Technology

PIC32MX440F128L-80V/BG by Microchip: 32-bit RISC CPU, 50 MHz clock, 131072 ROM words. Ideal for industrial applications with peripherals like timers, USB connectivity, and low power mode. Features include 16-Ch ADCs, 4 DMA channels, and integrated cache for efficient performance.

Median Price

$7.926

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 600 parts In-Stock

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$7.926

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Vyrian

USA . 7,067 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 184 parts In-Stock

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Bristol Electronics

USA . 184 parts In-Stock

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184

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Ampacity Inc.

Singapore . 443 parts In-Stock

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$4.000

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AZTECH Wire

Italy . 512 parts In-Stock

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$7.878

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Bastille Electronics

Australia . 10 parts In-Stock

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$7.926

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$7.530

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$7.054

10

$7.926

$7.530

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$7.054

Continental Prestige Electronics

USA . 1,701 parts In-Stock

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$7.926

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$7.767

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$7.767

Component Stockers USA

USA . 818 parts In-Stock

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$79.500

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Fulton Briggs Corp.

USA . 7,057 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,542 parts In-Stock

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Argo Parts USA

USA . 3,514 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the PIC32MX440F128L-80V/BG microcontroller by Microchip Technology. Designed with top-notch quality and reliability, this device offers unparalleled performance and versatility for a wide range of applications. With integrated cache, advanced peripherals, and low power mode, this microcontroller provides immense value and benefits to customers looking for efficient solutions. Trust in Microchip Technology's expertise in the industry and experience seamless connectivity, high-speed processing, and superior functionality with the PIC32MX440F128L-80V/BG. Elevate your projects to the next level with this exceptional device.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, ensuring a longer lifespan.

Integrated Cache: YES

Integrated cache helps in improving performance by storing frequently accessed data for quicker access.

Maximum Supply Voltage: 3.6 V

Allows for a higher supply voltage which can support more powerful operations and components.

On Chip Data RAM Width: 8

8-bit data RAM width enables efficient data processing and storage capabilities.

Package Shape: SQUARE

Square package shape allows for a compact design, saving space on the circuit board.

No. of Terminals: 121

With 121 terminals, this microcontroller can support a wide range of input and output connections for versatile applications.

No. of External Interrupts: 5

5 external interrupts provide flexibility for handling various external events and triggers.

Maximum Clock Frequency: 50 MHz

High clock frequency allows for faster processing speed and improved performance.

ADC Channels: YES

Analog to Digital Converters enable the microcontroller to interface with analog sensors and devices.

No. of Timers: 7

7 timers provide precise timing control for different tasks and operations.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller architecture offers high performance and power efficiency for a wide range of applications.

Technical Specifications

Microcontrollers PIC32MX440F128L-80V/BG attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B121

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of I/O Lines:

85

No. of Serial I/Os:

2

No. of Terminals:

121

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA121,11X11,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Speed:

80 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

EUSART(2), I2C(2), SPI(2), USB

Peripherals:

BOR, COMPARATOR(2), DMA(4), POR, RTCC, TIMER(7), WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

PIC32MX440F128L-80V/BG Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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