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PIC32MX350F256HT-I/MR

Microchip Technology

PIC32MX350F256HT-I/MR by Microchip Technology

PIC32MX350F256HT-I/MR by Microchip Technology is a 32-bit microcontroller with 64 terminals, operating at a max frequency of 80 MHz. It features 28-Ch 10-Bit ADC channels and offers connectivity options like I2C, SPI, UART, and USB. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.

Median Price

$7.355

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$7.355

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$7.355

-

-

-

Vyrian

USA . 7,665 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,665

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 717 parts In-Stock

1+ parts

$10.888

100+ parts

-

1k+ parts

-

10k+ parts

-

717

$10.888

-

-

-

Ampacity Inc.

Singapore . 479 parts In-Stock

1+ parts

$28.000

100+ parts

-

1k+ parts

-

10k+ parts

-

479

$28.000

-

-

-

West Coast Incorporated

USA . 4,228 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,228

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-

-

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$7.208

1k+ parts

$6.987

10k+ parts

$6.840

1,000

-

$7.208

$6.987

$6.840

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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500

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Overview

Unlock endless possibilities with the PIC32MX350F256HT-I/MR microcontroller by Microchip Technology. Built with top-notch quality and cutting-edge technology, this device offers unparalleled performance in a compact package. Ideal for a wide range of applications, from industrial automation to consumer electronics, this microcontroller provides reliable and efficient solutions for your projects. Experience seamless connectivity, low power consumption, and advanced features that will take your designs to the next level. Elevate your creations with the PIC32MX350F256HT-I/MR and unleash your innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller suitable for a wide range of applications.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options, accommodating a range of voltage sources.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture typically results in higher performance and efficiency compared to CISC architectures, enhancing the overall functionality of the microcontroller.

Maximum Clock Frequency: 80 MHz

The high clock frequency allows for fast and efficient operation of the microcontroller, making it suitable for demanding applications.

Connectivity: I2C(2), I2S(2), IRDA, LIN, RS232, RS485, SMBUS, SPI(2), UART(4), USB

The wide range of connectivity options enables easy integration with other devices and systems, enhancing the flexibility and versatility of the product.

Technical Specifications

Microcontrollers PIC32MX350F256HT-I/MR attributes and parameters. Explore more Microcontrollers devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

PIC32

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

5

No. of I/O Lines:

53

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

65536

RAM Words:

65536

ROM Words:

274432

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Speed:

100 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

75 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C(2), I2S(2), IRDA, LIN, RS232, RS485, SMBUS, SPI(2), UART(4), USB

Peripherals:

BOR, COMPARATOR(2), DMA(4), POR, PWM(5), RTC, TIMER(5), WDT

Analog To Digital Convertors:

28-Ch 10-Bit

Trade Compliance

PIC32MX350F256HT-I/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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